Single surface-adhesion device and method
A technology of adhesion and surface coating, which is applied in the direction of assembling printed circuits, electrical components, electrical components, etc. of electrical components, and can solve the problems of missing electronic components, incorrect angles, and deflection of electronic components.
Inactive Publication Date: 2011-05-25
SHENZHEN WEWINS WIRELESS
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Problems solved by technology
[0009] In addition, since the electronic components are filled with solder paste one by one, although most of them are now automated facilities, it is still possible to cause the electronic components to be missed.
Furthermore, when the electronic components are placed on the solder paste, the position of the electronic components will be skewed or the angle will be incorrect.
Method used
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[0034] Please refer to figure 1 , which is a schematic cross-sectional view of the first embodiment of the disposable surface mount device. The one-time surface mount device proposed by the present invention is used to fix a plurality of electronic components 30 on the printed circuit board 40 , and the surface of the printed circuit board 40 is coated with a layer of conductive metal paste 50 . Depend on figure 1 As can be seen from the illustration, the disposable surface mount device includes: a housing module 10 and an air module 20 .
[0035] The accommodating module 10 has a plurality of grooves 12 , each groove 12 is used for accommodating each electronic component 30 , and a through hole 14 is formed at the bottom of each groove 12 . Wherein, each through hole 14 penetrates to the bottom of the accommodating module 10 . Therefore, the accommodating module 10 is specially designed for a plurality of electronic components 30 that need to be fixed on the printed circ...
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A single surface-mount device and a method are used for fixing a plurality of electronic components on a printed circuit board. The surface of the printed circuit board is coated with conductive metalA single surface-mount device and a method are used for fixing a plurality of electronic components on a printed circuit board. The surface of the printed circuit board is coated with conductive metalpaste. The single surface-mount device comprises: a holding module with a plurality of grooves, each of which is used for holding an electronic component and provided with a through hole at the botto paste. The single surface-mount device comprises: a holding module with a plurality of grooves, each of which is used for holding an electronic component and provided with a through hole at the bottom; and an air module, which sucks air from the through holes to absorb the electronic components in the grooves and blows air to the through holes to push the electronic components out of the groovesm; and an air module, which sucks air from the through holes to absorb the electronic components in the grooves and blows air to the through holes to push the electronic components out of the groovesand attach the electronic components to the conductive metal paste of the printed circuit board simultaneously.and attach the electronic components to the conductive metal paste of the printed circuit board simultaneously.
Description
technical field [0001] The invention relates to a surface adhesive device and method, in particular to a one-time surface adhesive device and method. Background technique [0002] Surface Mount Technology (SMT) is an assembly technology applied to electronic products. The assembly method is to apply solder paste on the printed circuit board (PCB), and then place surface mount components (Surface Mount Component, SMC), such as resistors, capacitors, transistors and integrated circuits (IC), etc., and then reflow ( Reflow) is a technology that melts solder paste and solders electronic components on printed circuit boards. Compared with the earlier method of bonding electronic components and printed circuit boards, the component pins are inserted into the through holes, and then the solder is filled into them for metallization to form a whole. In terms of advantages, SMT can be soldered on both sides of the printed circuit board at the same time, while the earlier soldering t...
Claims
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IPC IPC(8): H05K3/34H05K13/04
Inventor 陈正基
Owner SHENZHEN WEWINS WIRELESS