Film coating method

A coating method and thin film technology, applied in the field of coating, can solve the problems such as the base material is not formed into a flat film

Inactive Publication Date: 2009-09-09
FUGANG ELECTRONICS DONGGUAN +1
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003]However, in the actual process, the substrate is not absolutely flat, and its surface often has depressions or protrusions. The spraying amount of part of the spray coating liquid is the same, so after the substrate is coated with the coating liquid, there are still depressions and protrusions on it, and a flat film has not yet been formed on the substrate

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Embodiment Construction

[0017] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0018] see figure 1 In the film coating method of the present invention, the control device 4 is used to control the first coating device 1 and the second coating device 2 to coat the coating liquid on the substrate 3 at the same time. Before coating, the base material 3 is fixed on the machine table 6, and the first coating solution tank 11 and the second coating solution tank 21 are respectively set on the first coating device 1 and the second coating device 2, Fill the coating solution respectively in the coating solution tank 11 and the second coating solution tank 21 and install a rod-shaped sensor 5 in the first coating solution tank 11, one end of the sensor 5 is fixed in the first coating device 1, and the other end Slightly protr...

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Abstract

The invention discloses a film coating method, which comprises the following steps: (1) controlling a first coating device and a second coating device by a control device to spray coating liquid on a base material simultaneously in the preset spraying amount; and (2) at the time of spraying the coating liquid on the base material, controlling a sensor by the control device to sense the adhesive force of the coating liquid between the first coating device and the base material; when sensing that the adhesive force of the coating liquid does not change, continuing executing the step (1); and when sensing that the adhesive force of the coating liquid changes, adjusting the spraying amount of the second coating device by the control device according to an adhesive force signal. In the film coating method, the control device adjusts the spraying amount of the second coating device according to the variation of the adhesive force of the coating liquid between the base material and the first coating device, so a smooth film is formed on the base material.

Description

technical field [0001] The invention relates to a coating method, in particular to a film coating method on wafers, circuit boards, glass plates, metal plates, plastic plates, ceramic plates and other substrates. Background technique [0002] Thin film coating has become an indispensable technology in various fields. The coating method of the existing film is as follows: the coating liquid is directly coated on the substrate with a constant spraying amount, and the coating liquid forms a coating layer with a uniform thickness on the substrate, and the coating layer is formed on the substrate after drying. film. [0003] However, in the actual process, the substrate is not absolutely flat, and there are often depressions or protrusions on its surface. Since the spraying equipment sprays the same amount of spraying liquid on the depressions, protrusions and flat parts of the substrate, the substrate is coated After the liquid is applied, there are still depressions and protr...

Claims

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Application Information

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IPC IPC(8): B05C9/06B05C11/10
Inventor 黄志豪
Owner FUGANG ELECTRONICS DONGGUAN
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