Device and method for cutting substrate

Abstract

The invention relates to a device and a method for cutting a substrate used in the manufacturing field of flat panel displays. The device is used for cutting the substrate which is provided with a positioning mark and a plurality of precut lines. The device for cutting the substrate comprises a positioning platform, an image positioning device, a knife flywheel cutting module and a laser cutting module, wherein the knife flywheel cutting module and the laser cutting module are arranged on both opposite sides of the image positioning device respectively; the positioning platform is used for supporting the substrate and ensuring that the substrate moves along a first direction and a second direction which is different from the first direction; the image positioning device is used for positioning the substrate according to the positioning mark; and the knife flywheel cutting module and the laser cutting module are respectively used for cutting the substrate along the precut lines.

Description

technical field [0001] The invention relates to a substrate cutting device and a substrate cutting method, in particular to a substrate cutting device and a substrate cutting method used in the field of flat panel display manufacturing. Background technique [0002] In the manufacturing process of flat panel display devices, it is usually necessary to use a cutting device to cut a large-sized substrate into small-sized substrates. [0003] See figure 1 , a cutting device 10 includes a positioning platform 11 for carrying a substrate 101, a cutter wheel cutting module 12 arranged above the positioning platform 11, and a cutter wheel cutting module 12 arranged above the positioning platform 11 and adjacent to the cutter wheel cutting module 12 The laser cutting module 13, and an image positioner (Charge Coupled Device, CCD) 14 arranged on the side of the laser cutting module 13 away from the cutter wheel cutting module 12. The positioning platform 11 can move along the X-axi...

AI Technical Summary

Problems solved by technology

For example: if H=50mm, d=1.5μm, L=250mm, then according to the formula d:H=D:L, D=7.5μm, that is, if the positioning platform 11 moves along the Y-axis direction in the X-axis direction If the average error is 1.5 μm, the center of the cutting area 121 and the center of the sensing area 141 will have an offset of 7.5 μm along the Y-axis direction. There will also be a large amount of deviation between the cutting line 105 formed on the surface and the pre-cutting line 103

It can be seen that since the positioning platform 11 has an average error d in the X-axis direction when it moves and the distance between the image locator 14 and the cutter wheel cutting module 12 is relatively far away, after positioning by the image locator 14 first, and then by There is a larger offset in the Y-axis direction between the cutting line 105 formed by cutting the cutter wheel cutting module 12 and the laser cutting module 13 and the pre-cutting line 103, so that the cutting device 10 cuts the substrate 101. may damage pre-formed small-scale substrates 104 (such as figure 1 shown), resulting in a lower yield of the resulting small-sized substrate 104

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