Mixed additive and fretsaw cutting fluid prepared from same

A technology of mixing additives and cutting fluids, which is applied in the direction of additives, lubricating compositions, petroleum industry, etc., can solve the problems of poor stability of cutting fluids, large wafer surface damage, low productivity, etc., to ensure stability and durability, and good cooling and lubricating effect, reducing the effect of surface damage

Active Publication Date: 2012-02-08
ANJI MICROELECTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its disadvantages are: large damage on the surface of the wafer; wide knife edge, large material loss; low productivity; therefore, the internal circle cutting is far from meeting the current production needs in terms of output and capacity, especially the rapid development of large-scale integrated circuits and solar cells. , the demand for wafers increased sharply, and people began to consider adopting more efficient cutting equipment, and the wire saw came into being
[0005] However, the existing cutting fluids have disadvantages such as poor stability, low cutting yield, high cost, and weak cutting ability.

Method used

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  • Mixed additive and fretsaw cutting fluid prepared from same
  • Mixed additive and fretsaw cutting fluid prepared from same
  • Mixed additive and fretsaw cutting fluid prepared from same

Examples

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preparation Embodiment 1

[0023] The present invention is further illustrated below with examples, but the present invention is not limited thereto. In the following examples, the percentages are all mass percentages.

[0024] Table 1 has provided the formula of the cleaning liquid embodiment 1~8 that is used for thick film photoresist of the present invention, presses listed component and its content in Table 1, organic base is added dropwise to organic base within 1 hour. in the acid, and keep stirring; after the dropwise addition of the organic base, continue to stir for 30 minutes; then add the metal corrosion inhibitor and stir for 20 minutes; ) was added and continued to stir for 30 minutes to obtain a mixed additive for wire saw cutting fluid.

preparation Embodiment 1～8

[0026]

[0027]

preparation Embodiment 2

[0029] According to the proportions in Table 2, add this mixed additive into an oily cutting base, such as polyethylene glycol, and stir for 30 minutes to obtain a cutting fluid for wire saw cutting.

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Abstract

The invention discloses a mixed additive and a fretsaw cutting fluid prepared from the same. The fretsaw cutting fluid has good dispersibility and capability of re-dispersing the abrasive to ensure the stability and durability of the configured mortar, the fretsaw cutting fluid has good cooling and lubricating functions, the surface damages of slices and the pollutions of mechanical stress, thermal stress and metal ions to the wafers can be reduced, the thickness error of the wafers can be effectively improved, and a thinner cutting line is used to increase the cutting yield.

Description

technical field [0001] The invention relates to a mixed additive, in particular to a mixed additive used for wire saw cutting fluid. Background technique [0002] With the rapid development of the electronics industry, wafers are more and more widely used in integrated circuits, solar cells, LED lighting and other industries, and wire saw cutting of wafers has also received more and more attention. The materials to be cut are mainly hard materials such as silicon, germanium, gallium arsenide, sapphire (aluminum oxide). [0003] The earliest use in the field of wafer processing is the outer circle cutting technology. This cutting method achieves the purpose of cutting by grinding the material to be cut by the diamond sheet grinding wheel clamped on the high-speed rotating spindle. With the development of material preparation technology and the increase of cutting diameter, the rigidity of the outer circular blade is poor, and the problem that the swing amount of the blade i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M161/00C10M169/04C10M173/02C10N30/04C10N30/06
Inventor 于昊宫勇
Owner ANJI MICROELECTRONICS (SHANGHAI) CO LTD
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