Mixed additive and fretsaw cutting fluid prepared from same

Abstract

The invention discloses a mixed additive and a fretsaw cutting fluid prepared from the same. The fretsaw cutting fluid has good dispersibility and capability of re-dispersing the abrasive to ensure the stability and durability of the configured mortar, the fretsaw cutting fluid has good cooling and lubricating functions, the surface damages of slices and the pollutions of mechanical stress, thermal stress and metal ions to the wafers can be reduced, the thickness error of the wafers can be effectively improved, and a thinner cutting line is used to increase the cutting yield.

Description

technical field [0001] The invention relates to a mixed additive, in particular to a mixed additive used for wire saw cutting fluid. Background technique [0002] With the rapid development of the electronics industry, wafers are more and more widely used in integrated circuits, solar cells, LED lighting and other industries, and wire saw cutting of wafers has also received more and more attention. The materials to be cut are mainly hard materials such as silicon, germanium, gallium arsenide, sapphire (aluminum oxide). [0003] The earliest use in the field of wafer processing is the outer circle cutting technology. This cutting method achieves the purpose of cutting by grinding the material to be cut by the diamond sheet grinding wheel clamped on the high-speed rotating spindle. With the development of material preparation technology and the increase of cutting diameter, the rigidity of the outer circular blade is poor, and the problem that the swing amount of the blade i...

AI Technical Summary

Problems solved by technology

Its disadvantages are: large damage on the surface of the wafer; wide knife edge, large material loss; low productivity; therefore, the internal circle cutting is far from meeting the current production needs in terms of output and capacity, especially the rapid development of large-scale integrated circuits and solar cells. , the demand for wafers increased sharply, and people began to consider adopting more efficient cutting equipment, and the wire saw came into being

[0005] However, the existing cutting fluids have disadvantages such as poor stability, low cutting yield, high cost, and weak cutting ability.

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