24results about How to "Improve cutting yield" patented technology

The utility model belongs to the technical field of glass production, and discloses a cutting dust removal device. According to the cutting dust removal device, the first cavity is formed in the supporting seat, the electrostatic dust removal airflow is introduced into the first cavity, the electrostatic dust removal airflow eliminates dust static electricity in time, the adhesive force of dust on the surface of a glass substrate is effectively removed in time, meanwhile, the dust is sucked and discharged through the dust suction assembly, negative pressure is formed in the first cavity, and the dust removal effect is improved. The dust dissipation to the outside of the first cavity is effectively reduced, and the pollution of the dust to the glass substrate is eliminated, so that the quality and the cutting yield of the glass substrate are remarkably improved.

The utility model relates to the technical field of automatic cutting equipment, in particular to novel automatic cutting equipment for building wall materials, which comprises a frame body, Y-axis guide rails are fixedly arranged on two sides of the frame body, a movable inverted U-shaped seat is arranged outside the frame body, and a Y-axis slider is arranged on the inner side of the inverted U-shaped seat. A Y-axis motor is fixedly arranged on the inverted U-shaped seat; z-axis guide rails and tool rests in sliding fit with the Z-axis guide rails are arranged on two side plates of the inverted-U-shaped base respectively, and the tool rests are driven by a Z-axis motor to move along the Z-axis guide rails; a forming tool used for machining a V-shaped groove along a to-be-cut line of a wall material and a cutting tool used for cutting the wall material along the V-shaped groove are arranged on the portions, on the two sides of the inverted-U-shaped base, of the tool rest correspondingly, and the cutting center of the forming tool and the cutting center of the cutting tool are located on the same straight line. The cutting device is convenient and practical, low in operation difficulty and high in automation degree, meets the requirement of a continuous production process, firstly forms and then cuts, and greatly improves the cutting yield.

The invention provides a diamond wire bus and a diamond wire, the diamond wire bus comprises a base body and a coating layer covering at least part of the surface of the base body, the coating layer comprises a first metal layer, and the first metal layer covers at least part of the surface of the base body; the second metal layer covers at least part of the surface, far away from the substrate, of the first metal layer; the third metal layer covers at least part of the surface, far away from the first metal layer, of the second metal layer; wherein the first metal layer comprises first metal, the second metal layer comprises second metal, and the third metal layer comprises third metal and fourth metal; the content of third metal in the third metal layer increases progressively in the direction away from the second metal layer; the fourth metal and the second metal are the same metal. The outer surface of the third metal layer can keep sufficient strength and cannot fall off while achieving a lubricating effect, and the inner surface of the third metal layer is combined with the second metal layer, so that the cutting process of hard and brittle materials can be continuously carried out, and the cutting yield is improved.

The invention discloses a wafer cutting method, and relates to the technical field of wafer cutting processing. The wafer comprises a front face and a back face which are oppositely arranged, the front face is provided with a plurality of chip function areas and cutting channel areas located between every two adjacent chip function areas, and the wafer cutting method comprises the steps that a front face protection film is attached to the front face of the wafer; carrying out thinning processing on the back surface of the wafer so that the wafer is thinned to a preset thickness; removing the protective film on the front surface, and pasting a through cutting film on the back surface of the wafer; performing laser grooving treatment on the front surface of the wafer corresponding to the cutting channel region; performing back laser transmission invisible cutting on the wafer subjected to the laser slotting treatment corresponding to the cutting channel region, so that the wafer is divided into a plurality of core particles; and stretching the through cutting film so as to enable two adjacent core particles in the wafer to generate an interval, and carrying out material taking treatment on the core particles. According to the method, the steps are few, the film reversing process from grooving to hidden cutting is omitted, the wafer cutting efficiency can be improved, the fragment rate is reduced, the number of core particles is increased, and the machining cost of a single core particle is reduced.

The utility model relates to the technical field of sterilization bags, in particular to a fixed-length cutting machine for a plane sterilization bag. Comprising an operation table, one side of the upper surface of the operation table is provided with a discharging machine used for containing a sterilization bag, and the two sides of the upper surface of the operation table are each provided with a graduated scale used for observing the cutting size of the sterilization bag. And then the fixing assembly is used for pressing and clamping the cutting position of the sterilization bag, and at the moment, the cutting assembly is used for cutting the sterilization bag, so that the cutting accuracy of the sterilization bag is effectively improved, the use stability of the cutting machine is improved, the cutting yield of the sterilization bag is improved, the situation that the sterilization bag is wasted is avoided, and economic benefits are increased. And the use flexibility of the cutting machine is improved, the cutting machine can be adjusted according to the length needing to be cut, and therefore the practicability of the cutting machine is improved.

The invention discloses an epoxy adhesive for a semiconductor cutting spliced rod and a preparation method of the epoxy adhesive, and relates to the technical field of epoxy adhesives. According to the epoxy glue for the semiconductor cutting splicing rod, under the compounding of the component A (mainly comprising POSS-epoxy and phenolic epoxy) and the component B (mainly comprising POSS-sulfydryl curing agent and modified amine curing agent), all the components have a synergistic effect, the structure of the obtained glue is similar to that of a semiconductor silicon wafer or silicon carbide after curing, and the adhesive has the advantages that the adhesive has a good adhesive force; the compatibility of the epoxy glue and a semiconductor material can be improved; the POSS-sulfydryl epoxy curing agent and the modified amine curing agent are selected to be matched with the epoxy resin, so that a bonding interface can be better filled, the hardness and strength of the cured adhesive are close to those of a semiconductor material and crystal characteristics, the cured adhesive has higher glass transition temperature, the hardness is slightly influenced by temperature in the cutting process, and the service life of the adhesive is prolonged. And the tungsten filament steel wire can pass through more smoothly, the wire bow is reduced, and the cutting yield is improved.

The utility model provides a chip sealing ring structure, which comprises a first sealing ring arranged around a chip integrated circuit area, the first sealing ring comprises a plurality of dielectric layers arranged in a laminated manner, and metal layers arranged in the dielectric layers and flush with the dielectric layers, through hole strips and through holes which are filled with conductive materials are arranged in the dielectric layer so as to realize the connection among the metal layers, and the through hole strips are curve-shaped. Compared with a linear through hole strip, the curved through hole strip can better resist stress applied to the chip when the chip is cut, the interface between the through hole strip and the metal layer is prevented from being broken when the chip is cut, namely, the sealing ring is prevented from being broken when the chip is cut, so that the phenomenon that the chip is layered and broken is avoided, and the cutting yield is improved.

The invention discloses a cutting fluid for a semiconductor material and a preparation method thereof, and relates to the technical field of cutting fluids. The semiconductor material provided by the invention is composed of the following raw materials: 0.001-30.00 parts of a water-soluble lubricant; 0.001 to 30.00 parts of an anti-wear lubricant; 0.001 to 20.00 parts of an extreme pressure lubricant; 0.001 to 50.00 parts of a special wetting agent; 0.001 to 30.00 parts of an emulsifying dispersant; 0.001 to 90.00 parts of an antirust agent; 0.001 to 90.00 parts of a corrosion inhibitor; 0.001 to 10.00 parts of a bactericide; 0.001 to 50.00 parts of a settling agent; and 0.001 to 99.00 parts of deionized water. The prepared cutting fluid for the semiconductor material has high permeability and high lubricity, the surface quality of slices is high, the warping degree is low, and the cutting efficiency and the yield are improved.

This invention proposes a high-frequency ultrasonic cutting tool that facilitates piercing and cutting. An auxiliary positioning mechanism is detachably connected to the outer wall of the first housing to assist in adjusting the cutting edge of the blade. This mechanism also connects to the external cutting machine mounting port, improving adjustment and installation efficiency. A limiting chamber and parallel-side mounting of the ultrasonic transducer assembly ensure stable assembly and reduce the failure rate. The flat-sword shaped blade facilitates cutting, and a drag-reducing surface lowers resistance, significantly reducing the risk of blade breakage. A pre-compression component pre-presses the material to facilitate cutting, improving the yield rate. A flexible ring assists in stress relief and prevents damage to the first and second housings when they are compressed, while also preventing overload during threaded connections, allowing for position adjustment, and extending service life.

The utility model discloses a roller body mechanism and a slicing machine, and belongs to the technical field of silicon wafer machining devices. The roller body mechanism comprises a first roller body, a second roller body and a third roller body which are arranged at intervals, the first roller body and the second roller body are flush in the first direction, the third roller body, the first roller body and the second roller body are arranged at intervals in the second direction, and the second direction intersects with the first direction; the first roller body and the second roller body are of a cylindrical structure, at least one end of the third roller body is provided with an adjusting part, and the adjusting part is of a conical structure.

A kind of automatic feeding cutting and separating mechanism of sticking magnetic core, including rack, the feeding mechanism, conveying mechanism, cutting and discharging mechanism are installed on the rack;The feeding mechanism is conveyed to cutting and discharging mechanism by conveying mechanism with sticking magnetic core workpiece, the screening mechanism that posture unqualified magnetic core is screened back to feeding mechanism is equipped on the conveying mechanism, the feeding mechanism includes hopper, hopper separation mechanism, pallet feeding mechanism, the hopper separation mechanism is equipped in the lower portion of hopper and can act after hopper is separated into multiple chambers to prevent magnetic core from being accumulated in the end portion of hopper, the pallet feeding mechanism is equipped in the end portion of hopper, the pallet feeding mechanism includes multiple fixed pallets arranged in stages, first stage fixed pallet is connected with the end portion of hopper, last stage fixed pallet is connected with conveying mechanism;Upper and lower pallets for conveying magnetic core from previous stage fixed pallet to later stage fixed pallet are arranged between adjacent fixed pallets, and multiple upper and lower pallets are synchronously arranged.

This invention discloses a capacitor cutting device and method, including a frame, a conveyor line arranged along the X-axis on the frame, a transfer mechanism arranged on the frame on one side of the conveyor line, a positioning mechanism arranged on the frame on the other side of the conveyor line, a cutting mechanism arranged on the frame at one end of the conveyor line, and a blanking mechanism. Advantages: The entire device integrates the conveyor line, transfer mechanism, positioning mechanism, cutting mechanism, and blanking mechanism. Each process is automatically connected under the coordination of the control system, realizing full automation of the capacitor process from loading, conveying, positioning, cutting to blanking, without manual intervention, significantly improving production cycle time and overall capacity.

The invention relates to the technical field of display panel cutting, in particular to a display panel cutting method based on crack propagation, and mainly solves the technical problems that an existing display panel cutting method is low in cutting yield, easy to cause cutting damage and high in cutting cost. According to the method, firstly, the starting point of a pre-cutting path is heated and softened through a laser beam, then a cutting wheel is used for pressing downwards to form a paddle-tumbler, then a hot crack is formed below the paddle-tumbler through the laser beam, and finally the hot crack is guided to move along the pre-cutting path through movement of the laser beam, so that the display panel is broken automatically. According to the method, only the cutter wheel and the display panel need to be in short contact to complete indentation treatment, transverse cracks caused by long-time contact of the cutter wheel and the display panel can be effectively avoided, and therefore the cutting yield can be increased; and meanwhile, the laser beams cannot generate dust in the cutting process, so that a complex dust removal and cleaning system does not need to be arranged, cutting damage can be avoided, and meanwhile the cutting cost is effectively reduced.

The invention provides a material cutting parameter adjusting method, a slicing machine, an electronic device and a computer readable storage medium, the material cutting parameter adjusting method comprises the steps that in the material cutting process, actual cutting parameters of a material are obtained in real time, and the actual cutting parameters at least comprise cutting force, cutting time and a cutter feeding position; the actual cutting parameters are input into the decision model for fitting, and theoretical cutting force parameters are obtained; and according to the theoretical cutting force parameters, proportional integral differential control is conducted on the cutting parameters of the materials in the subsequent cutting process, so that the subsequent cutting force parameters are adjusted to be within the preset parameter range in real time. The problem that in the silicon wafer cutting process in the prior art, due to the fact that cutting force output of a diamond wire is unstable, the surface quality of the cut silicon wafer is unstable is solved.

The invention provides a knife rest and a cutting device. The tool rest comprises a rest body, a mounting groove and a cooling channel are formed in the rest body, the mounting groove is used for mounting the cutter wheel, and the cooling channel is communicated with the mounting groove and used for introducing cooling fluid into the mounting groove and cooling the cutter wheel mounted in the mounting groove. Therefore, the cutting yield is improved.

The present invention relates to the field of lithium battery separators, and the purpose of the present invention is to provide a battery separator and a coating process and coating system therefor, and a battery. The coating process comprises: carrying out preliminary heat setting of a polyolefin film, on-line coating of the polyolefin film and heat setting of a coated film. The coating system comprises a plurality of ovens arranged in a travel path of the heat setting of a polyolefin film, and a coating device for coating the polyolefin film with a coating slurry arranged in spacing between adjacent ovens. The on-line coating process is arranged at the stage before the end of the heat setting of the polyolefin film, the polyolefin-based film and the coating slurry are dried by fully utilizing a polyolefin film heat setting oven temperature, and the coating is in close contact with the polyolefin-based film, such that the heat resistance of the coated film is effectively improved, and the water content of the coated film is reduced. Compared with an existing process flow, the process is simplified, and the slitting pass rate is also significantly improved.

The invention relates to an automatic cutting production line of a building wallboard and a cutting method of the automatic cutting production line. The production line comprises a front floating grabbing device, a conveying platform, a material raw board, a raw board longitudinal cutting device, a belt conveyor, an arc-shaped guide device, an air cylinder, a fixed wheel, a raw board transverse cutting device and a rear floating grabbing device, and the whole automatic cutting production line is arranged in a concave shape; the cutting method comprises the steps of raw plate feeding, plate conveying, plate longitudinal cutting, excess material stripping, positioning conveying, plate transverse cutting and raw plate discharging. The method is reasonable and feasible, low in operation difficulty, high in automation degree and capable of meeting the requirement of a continuous production process, cutting is conducted after forming, the cutting yield is greatly improved, large-scale production is met, the production efficiency is greatly improved, and the problems that in existing building wall material cutting, a cutting opening has large flaws, the yield is not high, and the production cost is low are solved. And single-machine single-piece cutting cannot meet the requirements of large-scale production, and the production efficiency is low, and good market prospects and development space are achieved.

The present application belongs to the field of silicon wafer cutting technology, and specifically relates to a modified polycarboxylate and a preparation method thereof, a water-based cutting fluid containing the same, and an application of the water-based cutting fluid. The modified polycarboxylate provided in the present application includes a structural unit A and a structural unit B. The water-based cutting fluid provided in the present application includes the above-mentioned modified polycarboxylate, a pH regulator, a polyol, and water. The water-based cutting fluid of the present application has stable performance, is easy to store, is environmentally friendly, and can effectively improve the dispersibility of the mortar during the cutting process.

The utility model relates to a gas core cutting detection device, which comprises a pre-cutting detection assembly or / and a post-cutting detection assembly, the pre-cutting detection assembly comprises a first detection frame, a first detection assembly, a transfer unit and a first defective product collector; the post-cutting detection assembly comprises a second detection frame, a second detection assembly, a material distribution assembly and a second defective product collector; the first detection assembly and the second detection assembly are respectively provided with a plurality of detection heads, and a gas core is placed on a product carrying seat of the first detection frame; the first detection assembly and the transfer unit are slidably mounted on the first detection frame, and the detected defective product gas core is transferred to the first defective product collector by the transfer unit; the cut air cores are detected and then transferred to the material distribution assembly for product material distribution, and defective products are collected by the second defective product collector. The utility model further relates to gas core cutting equipment provided with the gas core cutting detection device. The gas core cutting equipment comprises a feeding assembly, a gas core transferring assembly and a cutting assembly. The gas core cutting detection device is high in automation degree and high in production efficiency.

The invention provides a miniature LED chip and a manufacturing method thereof, and the manufacturing method of the miniature LED chip provided by the invention comprises the steps: forming a plurality of sub epitaxial laminations which are arranged at intervals through cutting channels and cutting alignment structures which are arranged corresponding to the sub epitaxial laminations through deep etching of the epitaxial laminations, according to the cutting alignment structure, the channels and the corresponding sub epitaxial laminations are arranged at intervals, the channels are cutting deviation control lines, the cutting alignment precision can be improved when physical separation of an LED chip device is achieved through the cutting channels, and then the cutting yield is improved; besides, a photoresist grid line pattern is formed on the surface of the cutting channel preset area, the substrate is exposed through a dry etching process to form the cutting channel, the grid line density of the photoresist grid line pattern is gradually reduced in the direction from the center of the epitaxial lamination layer to the edge of the epitaxial lamination layer, and no grid line exists in the edge area of the epitaxial lamination layer; the load effect related to the etching depth-to-width ratio is utilized to improve the line width uniformity of the etching cutting channel, and the cutting yield is further improved.

This application provides an LED epitaxial scribing device, comprising: a scribing control unit, a ranging unit, an objective lens, a laser path, and a laser; the scribing control unit is connected to both the ranging unit and the laser; the ranging unit is mounted on the objective lens and is used to measure the thickness of the area to be scribed on the LED epitaxial layer; the laser, upon receiving the thickness value fed back from the ranging unit by the scribing control unit, emits a laser with a power matching the thickness value to the laser path; the laser path transmits the laser to the objective lens, so as to scrib the area to be scribed on the LED epitaxial layer through the objective lens. This application improves product cutting yield and scribing process stability by dynamically adjusting the laser power through thickness measurement of different areas of the epitaxial layer.

The application discloses a bonded wafer cutting method and relates to the technical field of semiconductor processing. The bonded wafer cutting method comprises the following steps: forming a first groove on a first surface of a silicon layer by using laser burning, and extending the first groove to a first surface of a glass lens; forming a crack corresponding to the first groove on a second surface of the glass lens by using laser cutting, and extending the crack to a second surface of the silicon layer; and applying force to the crack to split the glass lens. The bonded wafer cutting method solves the problems that, in the prior art, directly cutting with a blade will cause too large edge collapse due to the difference in material between the upper and lower layers of the bonded wafer, and directly cutting with the same kind of laser will cause low yield due to the difference in ablation effect of the same kind of laser on silicon and glass, and can simultaneously ensure the cutting effect of silicon and glass and improve the cutting yield of the bonded wafer.

The application discloses a kind of bar rolling method, including double-length flying shear shearing process, double-length flying shear shearing process is sheared to rolling piece by double-length flying shear, double-length flying shear includes outlet guide groove, the outlet guide groove includes the first guide portion and the second guide portion sequentially arranged along the direction of rolling piece, the bottom guide surface of first guide portion is inclined downward, the included angle between the bottom guide surface of first guide portion and the bottom guide surface of second guide portion is not greater than preset angle, the preset angle is 3 °, in the double-length flying shear shearing process, by the bottom guide surface of first guide portion, rolling piece is guided into second guide portion.The bar rolling method of the application, by optimizing the design of double-length flying shear outlet, the design of expansion site can prevent the abnormal situation that the head and tail of rolling piece suddenly fall, avoid cutting head when sizing, can improve the quality of bar product and bar cutting yield, and can improve the economic benefit of production.

The invention provides a diamond wire bus, a preparation method and a diamond wire. The diamond wire bus comprises a base body and a coating layer covering at least part of the surface of the base body, the coating layer comprises a first metal layer, and the first metal layer covers at least part of the surface of the base body; the second metal layer covers at least part of the surface of the first metal layer, and the third metal layer covers at least part of the surface of the second metal layer; the second metal layer comprises first metal; the third metal layer comprises second metal and third metal, and the content of the second metal in the third metal layer is gradually increased in the direction away from the second metal layer; the third metal and the first metal are the same metal. The second metal layer can play a role in lubricating and coordinating deformation of the base body in the subsequent cold drawing deformation process; the outer surface of the third metal layer has a lubricating effect in the cold drawing deformation process and can keep enough strength without falling off at the same time, so that the drawing process of the diamond wire or the diamond wire bus can be continuously carried out.