8results about How to "Improve cutting yield" patented technology

This invention proposes a high-frequency ultrasonic cutting tool that facilitates piercing and cutting. An auxiliary positioning mechanism is detachably connected to the outer wall of the first housing to assist in adjusting the cutting edge of the blade. This mechanism also connects to the external cutting machine mounting port, improving adjustment and installation efficiency. A limiting chamber and parallel-side mounting of the ultrasonic transducer assembly ensure stable assembly and reduce the failure rate. The flat-sword shaped blade facilitates cutting, and a drag-reducing surface lowers resistance, significantly reducing the risk of blade breakage. A pre-compression component pre-presses the material to facilitate cutting, improving the yield rate. A flexible ring assists in stress relief and prevents damage to the first and second housings when they are compressed, while also preventing overload during threaded connections, allowing for position adjustment, and extending service life.

A kind of automatic feeding cutting and separating mechanism of sticking magnetic core, including rack, the feeding mechanism, conveying mechanism, cutting and discharging mechanism are installed on the rack;The feeding mechanism is conveyed to cutting and discharging mechanism by conveying mechanism with sticking magnetic core workpiece, the screening mechanism that posture unqualified magnetic core is screened back to feeding mechanism is equipped on the conveying mechanism, the feeding mechanism includes hopper, hopper separation mechanism, pallet feeding mechanism, the hopper separation mechanism is equipped in the lower portion of hopper and can act after hopper is separated into multiple chambers to prevent magnetic core from being accumulated in the end portion of hopper, the pallet feeding mechanism is equipped in the end portion of hopper, the pallet feeding mechanism includes multiple fixed pallets arranged in stages, first stage fixed pallet is connected with the end portion of hopper, last stage fixed pallet is connected with conveying mechanism;Upper and lower pallets for conveying magnetic core from previous stage fixed pallet to later stage fixed pallet are arranged between adjacent fixed pallets, and multiple upper and lower pallets are synchronously arranged.

This invention discloses a capacitor cutting device and method, including a frame, a conveyor line arranged along the X-axis on the frame, a transfer mechanism arranged on the frame on one side of the conveyor line, a positioning mechanism arranged on the frame on the other side of the conveyor line, a cutting mechanism arranged on the frame at one end of the conveyor line, and a blanking mechanism. Advantages: The entire device integrates the conveyor line, transfer mechanism, positioning mechanism, cutting mechanism, and blanking mechanism. Each process is automatically connected under the coordination of the control system, realizing full automation of the capacitor process from loading, conveying, positioning, cutting to blanking, without manual intervention, significantly improving production cycle time and overall capacity.

The invention provides a material cutting parameter adjusting method, a slicing machine, an electronic device and a computer readable storage medium, the material cutting parameter adjusting method comprises the steps that in the material cutting process, actual cutting parameters of a material are obtained in real time, and the actual cutting parameters at least comprise cutting force, cutting time and a cutter feeding position; the actual cutting parameters are input into the decision model for fitting, and theoretical cutting force parameters are obtained; and according to the theoretical cutting force parameters, proportional integral differential control is conducted on the cutting parameters of the materials in the subsequent cutting process, so that the subsequent cutting force parameters are adjusted to be within the preset parameter range in real time. The problem that in the silicon wafer cutting process in the prior art, due to the fact that cutting force output of a diamond wire is unstable, the surface quality of the cut silicon wafer is unstable is solved.

The present invention relates to the field of lithium battery separators, and the purpose of the present invention is to provide a battery separator and a coating process and coating system therefor, and a battery. The coating process comprises: carrying out preliminary heat setting of a polyolefin film, on-line coating of the polyolefin film and heat setting of a coated film. The coating system comprises a plurality of ovens arranged in a travel path of the heat setting of a polyolefin film, and a coating device for coating the polyolefin film with a coating slurry arranged in spacing between adjacent ovens. The on-line coating process is arranged at the stage before the end of the heat setting of the polyolefin film, the polyolefin-based film and the coating slurry are dried by fully utilizing a polyolefin film heat setting oven temperature, and the coating is in close contact with the polyolefin-based film, such that the heat resistance of the coated film is effectively improved, and the water content of the coated film is reduced. Compared with an existing process flow, the process is simplified, and the slitting pass rate is also significantly improved.

This application provides an LED epitaxial scribing device, comprising: a scribing control unit, a ranging unit, an objective lens, a laser path, and a laser; the scribing control unit is connected to both the ranging unit and the laser; the ranging unit is mounted on the objective lens and is used to measure the thickness of the area to be scribed on the LED epitaxial layer; the laser, upon receiving the thickness value fed back from the ranging unit by the scribing control unit, emits a laser with a power matching the thickness value to the laser path; the laser path transmits the laser to the objective lens, so as to scrib the area to be scribed on the LED epitaxial layer through the objective lens. This application improves product cutting yield and scribing process stability by dynamically adjusting the laser power through thickness measurement of different areas of the epitaxial layer.

The application discloses a bonded wafer cutting method and relates to the technical field of semiconductor processing. The bonded wafer cutting method comprises the following steps: forming a first groove on a first surface of a silicon layer by using laser burning, and extending the first groove to a first surface of a glass lens; forming a crack corresponding to the first groove on a second surface of the glass lens by using laser cutting, and extending the crack to a second surface of the silicon layer; and applying force to the crack to split the glass lens. The bonded wafer cutting method solves the problems that, in the prior art, directly cutting with a blade will cause too large edge collapse due to the difference in material between the upper and lower layers of the bonded wafer, and directly cutting with the same kind of laser will cause low yield due to the difference in ablation effect of the same kind of laser on silicon and glass, and can simultaneously ensure the cutting effect of silicon and glass and improve the cutting yield of the bonded wafer.

The application discloses a kind of bar rolling method, including double-length flying shear shearing process, double-length flying shear shearing process is sheared to rolling piece by double-length flying shear, double-length flying shear includes outlet guide groove, the outlet guide groove includes the first guide portion and the second guide portion sequentially arranged along the direction of rolling piece, the bottom guide surface of first guide portion is inclined downward, the included angle between the bottom guide surface of first guide portion and the bottom guide surface of second guide portion is not greater than preset angle, the preset angle is 3 °, in the double-length flying shear shearing process, by the bottom guide surface of first guide portion, rolling piece is guided into second guide portion.The bar rolling method of the application, by optimizing the design of double-length flying shear outlet, the design of expansion site can prevent the abnormal situation that the head and tail of rolling piece suddenly fall, avoid cutting head when sizing, can improve the quality of bar product and bar cutting yield, and can improve the economic benefit of production.