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6results about How to "Improve cutting yield" patented technology

A high-frequency ultrasonic cutting tool that facilitates piercing and cutting.

ActiveCN117798982BPrevent installation overloadcut wellSevering textilesMetal working apparatusTool bitFailure rate
This invention proposes a high-frequency ultrasonic cutting tool that facilitates piercing and cutting. An auxiliary positioning mechanism is detachably connected to the outer wall of the first housing to assist in adjusting the cutting edge of the blade. This mechanism also connects to the external cutting machine mounting port, improving adjustment and installation efficiency. A limiting chamber and parallel-side mounting of the ultrasonic transducer assembly ensure stable assembly and reduce the failure rate. The flat-sword shaped blade facilitates cutting, and a drag-reducing surface lowers resistance, significantly reducing the risk of blade breakage. A pre-compression component pre-presses the material to facilitate cutting, improving the yield rate. A flexible ring assists in stress relief and prevents damage to the first and second housings when they are compressed, while also preventing overload during threaded connections, allowing for position adjustment, and extending service life.
Owner:SUZHOU JIAHUI ULTRASONIC TECH CO LTD

An automatic feeding, cutting and separating mechanism for bonded magnetic cores

A kind of automatic feeding cutting and separating mechanism of sticking magnetic core, including rack, the feeding mechanism, conveying mechanism, cutting and discharging mechanism are installed on the rack;The feeding mechanism is conveyed to cutting and discharging mechanism by conveying mechanism with sticking magnetic core workpiece, the screening mechanism that posture unqualified magnetic core is screened back to feeding mechanism is equipped on the conveying mechanism, the feeding mechanism includes hopper, hopper separation mechanism, pallet feeding mechanism, the hopper separation mechanism is equipped in the lower portion of hopper and can act after hopper is separated into multiple chambers to prevent magnetic core from being accumulated in the end portion of hopper, the pallet feeding mechanism is equipped in the end portion of hopper, the pallet feeding mechanism includes multiple fixed pallets arranged in stages, first stage fixed pallet is connected with the end portion of hopper, last stage fixed pallet is connected with conveying mechanism;Upper and lower pallets for conveying magnetic core from previous stage fixed pallet to later stage fixed pallet are arranged between adjacent fixed pallets, and multiple upper and lower pallets are synchronously arranged.
Owner:天通智能装备有限公司

A capacitor cutting device and cutting method

This invention discloses a capacitor cutting device and method, including a frame, a conveyor line arranged along the X-axis on the frame, a transfer mechanism arranged on the frame on one side of the conveyor line, a positioning mechanism arranged on the frame on the other side of the conveyor line, a cutting mechanism arranged on the frame at one end of the conveyor line, and a blanking mechanism. Advantages: The entire device integrates the conveyor line, transfer mechanism, positioning mechanism, cutting mechanism, and blanking mechanism. Each process is automatically connected under the coordination of the control system, realizing full automation of the capacitor process from loading, conveying, positioning, cutting to blanking, without manual intervention, significantly improving production cycle time and overall capacity.
Owner:KUNSHAN HUAYU AUTOMATION TECH

Material cutting parameter adjusting method, slicing machine, electronic device and computer readable storage medium

The invention provides a material cutting parameter adjusting method, a slicing machine, an electronic device and a computer readable storage medium, the material cutting parameter adjusting method comprises the steps that in the material cutting process, actual cutting parameters of a material are obtained in real time, and the actual cutting parameters at least comprise cutting force, cutting time and a cutter feeding position; the actual cutting parameters are input into the decision model for fitting, and theoretical cutting force parameters are obtained; and according to the theoretical cutting force parameters, proportional integral differential control is conducted on the cutting parameters of the materials in the subsequent cutting process, so that the subsequent cutting force parameters are adjusted to be within the preset parameter range in real time. The problem that in the silicon wafer cutting process in the prior art, due to the fact that cutting force output of a diamond wire is unstable, the surface quality of the cut silicon wafer is unstable is solved.
Owner:高测(盐城)技术有限公司

An LED epitaxial cleaving device

ActiveCN224424593UEasy to passReduce the probability of abnormal scratchesControl cellErbium lasers
This application provides an LED epitaxial scribing device, comprising: a scribing control unit, a ranging unit, an objective lens, a laser path, and a laser; the scribing control unit is connected to both the ranging unit and the laser; the ranging unit is mounted on the objective lens and is used to measure the thickness of the area to be scribed on the LED epitaxial layer; the laser, upon receiving the thickness value fed back from the ranging unit by the scribing control unit, emits a laser with a power matching the thickness value to the laser path; the laser path transmits the laser to the objective lens, so as to scrib the area to be scribed on the LED epitaxial layer through the objective lens. This application improves product cutting yield and scribing process stability by dynamically adjusting the laser power through thickness measurement of different areas of the epitaxial layer.
Owner:CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD