Cutting fluid for water-soluble monocrystalline silicon wafers or polycrystalline silicon wafers

A technology for monocrystalline silicon wafers and polycrystalline silicon wafers, applied in the petroleum industry, lubricating compositions and other directions, can solve the problems that silicon wafers are not easy to clean, affect the production efficiency and economic benefits of enterprises, and have high processing difficulty, and achieve the advantages of cutting precision and cutting finished products. rate, avoid damage or cracks on the surface of the silicon wafer, and reduce the difficulty of cleaning

Active Publication Date: 2011-04-20
南通宏申化工有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although the current domestic cutting fluid has good lubricating and thermal conductivity properties, there are problems such as poor dispersion of abrasives, low cutting yield, difficu

Method used

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  • Cutting fluid for water-soluble monocrystalline silicon wafers or polycrystalline silicon wafers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Take polyethylene glycol (PEG) with a molecular weight of 200: 95%; FC-4430: 0.5%; TX-10: 1%; triethylene glycol: 3%; isothiazolinone: 0.5%. After mixing the raw materials at 20-120°C, stir for 10-60 minutes to obtain the water-soluble cutting fluid.

[0015] Mix this cutting fluid with commercial SiC abrasive (cutting fluid: SiC=1:1) to cut 8-inch polycrystalline silicon. A total of 3,000 silicon wafers are processed in a batch. The silicon wafers are easy to clean, and the cutting yield is 95.5%.

Embodiment 2

[0017] Polypropylene glycol (PPG) with a molecular weight of 800: 90%; DC-7: 1%; TX-12: 3%; ethylene glycol: 5%; isothiazolone: ​​1%. After mixing the raw materials at 20-120°C, stir for 10-60 minutes to obtain the water-soluble cutting fluid.

[0018] Mix this cutting fluid with commercial SiC abrasive (cutting fluid: SiC=1:1) to cut 8-inch polycrystalline silicon. A total of 4,000 silicon wafers are processed in a batch. The silicon wafers are easy to clean, and the cutting yield is 97.3%.

Embodiment 3

[0020] Take polypropylene glycol polyalkylene glycol block copolymer (molecular weight 600): 85%; FC-16: 1.5%; Tween-80: 5%; ethylene glycol monomethyl ether: 7%; %. After mixing the raw materials at 20-120°C, stir for 10-60 minutes to obtain the water-soluble cutting fluid.

[0021] Mix this cutting fluid with commercial SiC abrasive (cutting fluid: SiC=1:1) to cut 8-inch polycrystalline silicon. A total of 3,000 silicon wafers are processed in a batch. The silicon wafers are easy to clean, and the cutting yield is 94.6%.

[0022] The concrete proportioning (mass percentage) and effect of embodiment 4 to 9 are shown in the following table:

[0023]

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PUM

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Abstract

The invention discloses a cutting fluid for water-soluble monocrystalline silicon wafers or polycrystalline silicon wafers, relating to the production technology field of the water-soluble cutting fluid for photovoltaic material monocrystalline silicon or polycrystalline silicon. The cutting fluid mainly comprises polyethylene alkanediol segmented copolymers (molecular weight: 200 to 800), fluorocarbon surfactants or fluosilicic surfactants, wetting-dispersing agents, polar solvents and antibacterial agents. The cutting fluid provided by the invention has the advantages of greatly reducing the surface tension of the cutting fluid under an extremely low concentration, greatly improving the wettability of the cutting fluid on abrasive materials, and avoiding the surface damage or rupture ofthe silicon wafers caused by the reunited abrasive materials, thereby facilitating the improvement of the cutting precision and cutting yield, and meanwhile, the cutting fluid also reduces the cleaning difficulty of the wafer. The cutting fluid can be simultaneously suitable for the machining on monocrystalline silicon and polycrystalline silicon, and the cutting yield can reach 97 percent.

Description

technical field [0001] The invention relates to a cutting fluid, in particular to the technical field of production of a water-soluble cutting fluid used for photovoltaic material monocrystalline silicon or polycrystalline silicon. Background technique [0002] With the rapid development of the photovoltaic industry, higher requirements are put forward for the size and surface accuracy of the upstream silicon wafer. Large-size, high-precision single / polycrystalline silicon wafers have become the development trend of solar silicon wafer materials. On the other hand, with the increasingly fierce competition, improving the yield of wire cutting while ensuring the quality of silicon wafer products is an effective means to enhance the market competitiveness of enterprises. [0003] Although the current domestic cutting fluid has good lubricating and thermal conductivity properties, there are problems such as poor dispersion of abrasives, low cutting yield, difficult cleaning of ...

Claims

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Application Information

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IPC IPC(8): C10M169/04C10N40/00
Inventor 方永勤许亮吴余冬
Owner 南通宏申化工有限公司
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