Cutting fluid for water-soluble monocrystalline silicon wafers or polycrystalline silicon wafers

Abstract

The invention discloses a cutting fluid for water-soluble monocrystalline silicon wafers or polycrystalline silicon wafers, relating to the production technology field of the water-soluble cutting fluid for photovoltaic material monocrystalline silicon or polycrystalline silicon. The cutting fluid mainly comprises polyethylene alkanediol segmented copolymers (molecular weight: 200 to 800), fluorocarbon surfactants or fluosilicic surfactants, wetting-dispersing agents, polar solvents and antibacterial agents. The cutting fluid provided by the invention has the advantages of greatly reducing the surface tension of the cutting fluid under an extremely low concentration, greatly improving the wettability of the cutting fluid on abrasive materials, and avoiding the surface damage or rupture ofthe silicon wafers caused by the reunited abrasive materials, thereby facilitating the improvement of the cutting precision and cutting yield, and meanwhile, the cutting fluid also reduces the cleaning difficulty of the wafer. The cutting fluid can be simultaneously suitable for the machining on monocrystalline silicon and polycrystalline silicon, and the cutting yield can reach 97 percent.

Description

technical field [0001] The invention relates to a cutting fluid, in particular to the technical field of production of a water-soluble cutting fluid used for photovoltaic material monocrystalline silicon or polycrystalline silicon. Background technique [0002] With the rapid development of the photovoltaic industry, higher requirements are put forward for the size and surface accuracy of the upstream silicon wafer. Large-size, high-precision single / polycrystalline silicon wafers have become the development trend of solar silicon wafer materials. On the other hand, with the increasingly fierce competition, improving the yield of wire cutting while ensuring the quality of silicon wafer products is an effective means to enhance the market competitiveness of enterprises. [0003] Although the current domestic cutting fluid has good lubricating and thermal conductivity properties, there are problems such as poor dispersion of abrasives, low cutting yield, difficult cleaning of ...

AI Technical Summary

Problems solved by technology

[0003] Although the current domestic cutting fluid has good lubricating and thermal conductivity properties, there are problems such as poor dispersion of abrasives, low cutting yield, difficult cleaning of silicon wafers, large amount of wastewater and high difficulty in treatment, which seriously affect the production efficiency and economy of enterprises. Benefit Year Activities

Images