Laser cutting method

A laser cutting, laser beam technology, applied in laser welding equipment, welding equipment, metal processing equipment and other directions, can solve the problem of high production cost

Inactive Publication Date: 2008-02-27
FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

When the above cutting method is used to cut the glass substrate, the droplets of the cooling fluid will often remain on the

Method used

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  • Laser cutting method

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Example Embodiment

[0011] Referring to FIG. 1, a laser cutting method for cutting a brittle material substrate provided by an embodiment of the present invention includes the following steps:

[0012] (1) Using a cracking tool to form pre-cut lines on the brittle material substrate. The brittle material substrate can be made of brittle materials such as ceramics, glass or quartz. The cracking tool can be a diamond knife or a knife wheel or the like.

[0013] (2) Using a laser beam to heat the brittle material substrate along the pre-cut line. The wavelength of the laser beam is related to the material of the brittle material substrate. When the brittle material substrate is made of ceramic, glass or quartz, the wavelength of the laser beam is usually 10.6 microns. Preferably, the brittle material substrate is heated to a temperature greater than 100 degrees Celsius, which is less than the vaporization temperature of the brittle material substrate.

[0014] (3) Cooling the heated brittle mater...

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Abstract

The invention discloses a laser cutting method to cut fragile material base, which comprises the following steps: utilizing a cracker to form pre-cutting line on the fragile material base; using laser beam to heat the fragile material base along the pre-cutting line; adopting gas lower than zero deg. c to cool the heat fragile material base without penetrating water among bases to influence the normal work to improve the cutting standard rate; cracking the fragile material base along the pre-cutting line. The invention uses gas not to remain residual drip on the surface of base, which needn't clean the base after cutting due to using gas as cooling flow, therefore reducing the manufacturing cost.

Description

technical field [0001] The invention relates to a laser cutting method, in particular to a method for cutting a brittle material substrate by using a laser beam. Background technique [0002] With the continuous development of display technology, liquid crystal display devices such as Thin Film Transistor Liquid Crystal Display (TFT-LCD) have been widely used in the consumer field, and are expected to replace traditional cathode ray tube (CRT) display devices. . Liquid crystal display devices such as TFT-LCD usually consist of two upper and lower glass plates, a liquid crystal housed between the two glass plates, and a number of circuits. The liquid crystal can change the arrangement mode under the action of the electric field to realize the display function of the TFT-LCD. In order to form liquid crystal display panels of different sizes, it is usually necessary to cut a larger size glass substrate. [0003] The glass substrate is usually cut by first using a cutter whee...

Claims

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Application Information

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IPC IPC(8): B23K26/00B23K26/42B23K26/402B23K26/70
Inventor 傅承祖黄俊凯陈献堂张明辉许宗富郭访璇
Owner FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC
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