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Modularized heat pump unit

A heat pump unit, modular technology, applied in the direction of heat pumps, refrigerators, refrigeration components, etc., can solve the problems of inability to realize cooling or heating of heat exchangers, inability to modularize, and limited use, so as to improve overall refrigeration efficiency and save energy. energy effect

Inactive Publication Date: 2009-10-21
XI'AN UNIVERSITY OF ARCHITECTURE AND TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the functions are small, and it cannot realize the function of cooling or heating by any heat exchanger, and it cannot recover cooling capacity, only heat; and it cannot achieve the modular effect like multi-line, which limits its application. use

Method used

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Embodiment Construction

[0011] In order to facilitate the description of the present invention, some circulation directions in the drawings are marked with letters a, b, c, etc.

[0012] The modular heat pump unit includes a compressor 1 and an electronic expansion valve 5. At least two modules are connected in parallel between the connection loop of the compressor 1 and the electronic expansion valve 5. The module includes a first three-way valve and a second three-way valve. , The first solenoid valve, the second solenoid valve and the heat exchanger. The three ports of the first three-way valve are respectively connected to one end of the first solenoid valve, the second solenoid valve and the heat exchanger. The three ports are respectively connected to the other end of the first solenoid valve, the second solenoid valve and the heat exchanger; the two ends of the first solenoid valve and the second solenoid valve are respectively connected between the connection loop of the compressor 1 and the elec...

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Abstract

The invention provides a modularized heat pump unit, comprising a compressor, an electronic expansion valve and at least two modules which are parallelly connected between the link-loops of the compressor and the electronic expansion valve; each module comprises a first three-way valve, a second three-way valve, a first electromagnetic valve, a second electromagnetic valve and a heat exchanger, the three ports of the first three-way valve are respectively connected with one end of the first electromagnetic valve, the second electromagnetic valve and the heat exchanger, and the three ports of the second three-way valve are respectively connected with the other end of the first electromagnetic valve, the second electromagnetic valve and the heat exchanger; the two ends of the first electromagnetic valve and the second electromagnetic valve are respectively connected between the link-loops of the compressor and the electronic expansion valve. With the invention adopted, each heat exchanger in each module can be a condenser or an evaporator, and the exchanger can be changed from a refrigerating / heating working condition into a heating / refrigerating working condition without changing the refrigerating or heating operation working conditions of other exchangers, thus improving the comprehensive refrigerating efficiency of the system, saving energy and satisfying the requirements of different customers.

Description

Technical field [0001] The invention relates to a heat pump unit, in particular to a modular heat pump unit with multiple functions. Background technique [0002] In the past, people mainly used single evaporator systems for heat pump units, such as figure 1 As shown, during the refrigeration operation, the compressor 100 sucks in the low-pressure low-temperature refrigerant vapor generated in the evaporator 101 to maintain the low-pressure state in the evaporator 101 to create conditions for the refrigerant liquid in the evaporator 101 to boil at low temperature. The vapor sucked in by the compressor 100 is compressed, and the pressure and temperature are increased to create the condition that the refrigerant can be liquefied at normal temperature. After the high-pressure and high-temperature refrigerant vapor is discharged from the compressor 100 into the condenser 102, it is cooled by the cooling medium under the condition of constant pressure, releases heat, decreases in tem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B30/02F25B41/04
Inventor 高然李安桂樊越胜司鹏飞
Owner XI'AN UNIVERSITY OF ARCHITECTURE AND TECHNOLOGY
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