Novel wafer fixing structure

A technology for fixing structures and wafers, which is applied in the direction of electric solid-state devices, semiconductor/solid-state device components, electrical components, etc., and can solve problems such as unsatisfactory, different light-emitting angles, and different light-emitting angles.
CN101562173AInactive Publication Date: 2009-10-21ZHEJIANG INVENLUX TECH
0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
ZHEJIANG INVENLUX TECH
Publication Date
2009-10-21
Estimated Expiration
Not applicable Β· inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
Patent Text Reader

Abstract

The invention provides a novel wafer fixing structure which makes up the deficiency of the prior lead frame or wafer holder and leads lighting angles of different lighting wafers when in lighting and conducting by fixing to be same and mixed light of the lighting wafers when in lighting to be uniform. The novel wafer fixing structure comprises a wafer holder and lighting wafers, wherein the wafer holder is provided with a plane wafer-fixing region which is internally provided with a concave wafer-fixing region, and the lighting wafers are fixed into corresponding wafer-fixing regions. The novel wafer fixing structure fixes the lighting wafers with different thickness in the plane wafer-fixing region and the concave wafer-fixing region respectively in a punching or etching mode through the arrangement of the concave wafer-fixing region in the plane wafer-fixing region of the wafer holder so as to lead the light heights among the light wafers to be consistent, thereby improving the lighting angle of the light wafers so as to lead the light mixing effect to be uniform when in lighting so that the purpose of the invention is achieved.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to a fixing structure, in particular to a novel chip fixing structure for fixing a light-emitting chip on a lead frame or a chip carrier. Background technique

[0002] At present, the fixation of light-emitting chips is achieved by using traditional lead frames or chip carriers, and the bottom of traditional lead frames or chip carriers is a flat die-bonding area as a whole, but since the thickness of the light-emitting chips is not Similarly, when the light-emitting chip is fixed in the plane die-bonding area of ​​the traditional lead frame or chip carrier and conducts light, the light-emitting angles between the light-emitting chips are not the same, resulting in differences in the light-emitting angles between the light-emitting chips. If it is too large, it will cause uneven light mixing between the light emitting chips after emitting light.

[0003] Take the traditional 3-4 element material light-emitting chip and GAN materi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More