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Method and device for placing liquid material

A technology of liquid material and filling method, which is applied in the direction of surface coating liquid device, electric solid device, semiconductor device, etc., can solve the problems of underfill material not covering semiconductor chips, poor semiconductor packaging, etc., and shorten the judgment time. Effect

Active Publication Date: 2009-10-21
MUSASHI ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, there are cases where the underfill material does not cover the entire periphery of the semiconductor chip, and the semiconductor package in this state is judged to be defective.

Method used

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  • Method and device for placing liquid material
  • Method and device for placing liquid material
  • Method and device for placing liquid material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0103] Figure 5 A schematic side view of the discharge device of this embodiment is shown. Figure 5 In , the horizontal direction of the drawing is defined as the X direction, the direction perpendicular to the drawing is defined as the Y direction, and the vertical direction of the drawing is defined as the Z direction.

[0104] The configuration and operation of the discharge device of this embodiment will be described below.

[0105] (constitute)

[0106] The substantially cylindrical syringe 7 stores the underfill material 5 inside. A discharge portion (nozzle) 6 having a diameter smaller than that of the syringe 7 communicates with the lower end of the syringe 7 , and an air tube 13 communicates with the end of the syringe 7 on the opposite side.

[0107] The air tube 13 is connected to the distributor 14 and supplies pressurized air into the syringe 7 via the air tube 13 . The dispenser 14 can deliver for a set time at a set pressure of the pressurized air.

[010...

Embodiment 2

[0155] In the imaging step and the judging step, in order to make a highly reliable judgment, it is preferable to judge that the liquid material has reached as many locations as possible on one semiconductor chip 2 . However, from the viewpoint of productivity, it is preferable that there are fewer sites to be determined. Therefore, in this embodiment, an attempt is made to efficiently determine whether the filling of the underfill material 5 is good or not with fewer locations.

[0156] Figure 9 (a) shows the case of supplying the underfill material 5 while moving the discharge unit 6 along the side AB which is one side of the semiconductor chip 2 . In this case, it is only necessary to capture an image including the periphery of the semiconductor chip 2 for the corners C and D not belonging to the side where the underfill material 5 is provided, and determine whether or not the underfill material 5 has reached. In the case where it is desired to perform shooting determina...

Embodiment 3

[0161] Such as Figure 10 As shown, in this embodiment, each step in the case where a plurality of semiconductor chips 2A, 2B, 2C, and 2D are placed on one substrate 1 will be described.

[0162] In the present embodiment, instead of performing the supplying step to the supplementary step on the semiconductor chips 2A to 2D individually, the imaging step to the supplementary step are performed on the entire semiconductor chips 2A to 2D first after the provisioning step. That is, after the providing steps are performed in the order of the semiconductor chips 2A, 2B, 2C, and 2D, the photographing and judging steps are carried out in the order of the semiconductor chips 2A, 2B, 2C, and 2D. The poorly filled semiconductor chip 2 of 5 is subjected to a supplementary step.

[0163] In this way, the reason why the providing step to the replenishing step are not respectively performed on the semiconductor chips 2A to 2D is that there is a time lag from the time when the provided unde...

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Abstract

A method and device for placing a liquid material, in which the device has a high degree of construction freedom and can supply an appropriate amount of the liquid material without complex control. The method utilizes the capillary effect and is used to fill a gap between a substrate and work, held on the substrate, with a liquid material discharged from a discharge section, and the device is used for the method. The method has a supply step for supplying the liquid material to an edge of the work from the discharge section; an imaging step for capturing, by imaging means, an image of that edge of the work from which the liquid material supplied in the preceding supply step is assumed to exude by the capillary effect; a determination step for detecting the presence of the liquid material at the edge of the work based on the captured image and determining whether the liquid material is placed in the entire region of the gap between the substrate and the work; and a replenishment step for supplying the liquid material from the discharge section to the edge of the work when a failure is determined.

Description

technical field [0001] The present invention relates to a method of filling the gap between a substrate and a workpiece held thereon by using capillary phenomenon with a liquid material discharged from a discharge part, and particularly relates to a method that can be properly used in the underfill step of a semiconductor package. Method and device for filling liquid material. [0002] Furthermore, the term "discharge" in the present invention includes a discharge method in which the liquid material contacts the workpiece before leaving the discharge part, and a discharge method in which the liquid material contacts the workpiece after leaving the discharge part. Background technique [0003] Such as figure 1 As shown, the structure of the semiconductor package is as follows, and the semiconductor chip is connected to the substrate via solder bumps. Filling the gap between the substrate and the semiconductor chip with an underfill material alleviates the effects of thermal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56B05D1/00B05D3/00
CPCH01L2224/73203H01L21/563H01L2924/01067H01L2924/01004B05D1/00B05D3/00H01L21/56
Inventor 生岛和正
Owner MUSASHI ENG INC