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Method for supplying treatment gas, treatment gas supply system, and system for treating object

A technology for processing gases and objects, applied in thin material processing, control/regulation systems, chemical instruments and methods, etc., and can solve problems such as thermal damage to precision instruments

Active Publication Date: 2009-10-28
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this case, it is not preferable to take such a measure because precision instruments around the semiconductor manufacturing equipment may be damaged by heat

Method used

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  • Method for supplying treatment gas, treatment gas supply system, and system for treating object
  • Method for supplying treatment gas, treatment gas supply system, and system for treating object
  • Method for supplying treatment gas, treatment gas supply system, and system for treating object

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Embodiment Construction

[0047] Embodiments of the method for supplying processing gas, the system for supplying processing gas, and the system for processing an object to be processed according to the present invention will be described below with reference to the accompanying drawings.

[0048] figure 1 is a schematic structural view showing an example of a system for processing an object to be processed including the system for supplying processing gas and the processing apparatus according to the present invention. figure 2 It is a schematic structural view showing an example of a low differential pressure type mass flow rate control device having a diaphragm used in a processing system for processing gas according to the present invention. Here, as an example, an HF gas which is polymerizable depending on pressure and / or temperature, or whose degree of polymerization changes, is used as the process gas. In addition, as an example, an etching apparatus which performs an etching process on a to-b...

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Abstract

This invention provides a method for supplying a treatment gas, comprising the step of producing a treatment gas polymerizable depending upon the temperature and the step of supplying the produced treatment gas to a treating apparatus (4) for treating an object (W) with the produced treatment gas in a predetermined manner in a reduced pressure atmosphere. In supplying the treatment gas to the treating apparatus (4), the flow rate of the treatment gas is regulated with a mass flow rate control unit (34) of a low differential pressure type which comprises a diaphragm (80) and has a proper operation range of a supply pressure below the atmospheric pressure. The above constitution can regulate the supply amount (actual flow rate) of the treatment gas polymerizable depending upon the temperature, for example, HF gas in an accurate and stable manner.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS [0002] The present application is based on and claims priority from a prior Japanese Patent Application No. 2006-306109 filed on Nov. 13, 2006, the entire contents of which are incorporated herein by reference. technical field [0003] The present invention relates to a method for supplying a process gas such as HF gas (hydrogen fluoride gas) to an object to be processed such as a semiconductor wafer, a system for supplying such a process gas, and a system for processing the object to be processed. Background technique [0004] In order to manufacture semiconductor integrated circuits such as semiconductor wafers formed from silicon substrates and the like, various treatments such as film formation treatment, etching treatment, oxidation treatment, diffusion treatment, and natural oxide film removal treatment are generally performed. In particular, in an etching process for removing a natural oxide film of a silicon substrate,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01J4/00G01F1/00G01F1/68G05D7/06H01L21/205H01L21/302
CPCG01F15/005Y02E60/34G05D7/0635G01F1/68Y10T137/8593Y10T137/0396B01J4/00G01F1/00G05D7/06
Inventor 釜石贵之小森荣一山内晋林明史
Owner TOKYO ELECTRON LTD
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