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Radiating device

A technology of heat dissipation device and heat sink group, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., and can solve the problems of increasing processing costs and wasting raw materials

Active Publication Date: 2009-11-04
CHAMP TECH OPTICAL FOSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the manufacturing process of the heat sink, the base and the heat sink fins are provided with grooves for matching with the heat pipes, which not only wastes raw materials but also increases processing costs.

Method used

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  • Radiating device
  • Radiating device
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] Figure 1 to Figure 3 The heat dissipation device in a preferred embodiment of the present invention is shown, and the heat dissipation device is used to dissipate the heat generated by the heat-generating electronic components installed on the circuit board such as the central processing unit. The heat dissipation device includes a base 10, a A first cooling fin set 20 on the top surface of the base 10 and a second cooling fin set 30 thermally connected to the bottom surface of the base 10 .

[0015] The base 10 is composed of a first substrate 12 , a second substrate 14 and a heat pipe group 16 interposed between the first substrate 12 and the second substrate 14 . The first substrate 12 is a rectangular thin metal plate made of metal materials with good thermal conductivity such as aluminum and copper. The bottom surface of the first substrate 12 is attached to the top surface of the heat-generating electronic component to absorb its heat.

[0016] The above-mentio...

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PUM

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Abstract

The invention relates to a radiating device which comprises a base and a first radiating rib group attached at the top surface of the base. The base comprises a first baseplate, a second baseplate and a thermotube group clamped between the first baseplate and the second baseplate, wherein the second baseplate is provided with a center hole; the top surface of the thermotube group is protruded with an embedding part embedded in the center hole; and the bottom surface of the thermotube group is concavely provided with a containing part containing the first baseplate. The thermotube group of the radiating device is clamped between the first baseplate and the second baseplate, the thick base is substituted by two relatively thin metal plates, and the base and a radiating body do not need to be provided with grooves containing thermotubes, therefore, the processing cost and time are reduced, and raw materials are saved.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for cooling electronic components. Background technique [0002] With the continuous development of the electronic industry, the operating speed and overall performance of electronic components (especially the central processing unit) are constantly improving. However, its calorific value has also increased. On the other hand, its volume has become smaller and smaller, and its heat generation has become more concentrated. This has made it impossible for the industry to use heat dissipation devices that only use metal entities for heat dissipation to meet the heat dissipation requirements of high-end electronic components. [0003] A common heat dissipation device and its base include a base in contact with the heat source, a number of heat dissipation fins arranged at equal intervals on the base, and several heat dissipation fins interposed between the base a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/34H01L23/367H01L23/427
CPCH01L23/427H01L2924/0002H01L2924/00
Inventor 熊海刚周志勇
Owner CHAMP TECH OPTICAL FOSHAN