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Device and method for bonding wafer and method for leveling the bonded wafer

一种晶片、接合头的技术，应用在电气元件、电固体器件、半导体/固态器件制造等方向，能够解决时间长、接合系统产能低等问题，达到大产能、可靠度提升的效果

Active Publication Date: 2011-04-20
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in some applications, such as copper-to-copper direct bonding, temperatures above 300°C are required, making figure 1 and figure 2 The leveling joint system shown has limited use
Furthermore, the low throughput of the above-mentioned bonding system is partly due to the relatively long time for leveling and bonding each wafer

Method used

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  • Device and method for bonding wafer and method for leveling the bonded wafer
  • Device and method for bonding wafer and method for leveling the bonded wafer
  • Device and method for bonding wafer and method for leveling the bonded wafer

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Embodiment Construction

[0033] The following description is the manufacture and use of the embodiment of the present invention. It must be appreciated, however, that the present invention provides many suitable inventive concepts that can be embodied in many different specific contexts. The specific embodiments mentioned are only used to illustrate the manufacture and use of the present invention in a specific way, and are not intended to limit the scope of the present invention.

[0034] A novel leveling and bonding system and method for performing a leveling and bonding process are provided below, and the differences and operations of the preferred embodiments are described. In the embodiments of the present invention, the same components use the same reference numerals.

[0035] image 3A partial leveling joint system 100 is shown comprising a joint head 20 and a joint socket 22 . The bonding head 20 and the bonding socket 22 are preferably located in a controlled environment 24, which can be f...

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Abstract

The present invention discloses a device and a method for bonding the wafer, wherein the device comprises the following components: a bonding bearing, a bonding head and a sheet transmitter. The bonding bearing is used for bearing the wafer. The bonding head is positioned above the bonding bearing, wherein the bonding bearing and the bonding head have configurations which move relatively to each other. The sheet transmitter is used for transmitting a sheet on the wafer. The invention also discloses a method for leveling the bonded wafer. The device and the method according to the invention have the advantages of larger output, reliability increase and using extending of a wafer leveling system to the high-temperature application.

Description

technical field [0001] The invention relates to the manufacture of an integrated circuit, in particular to a device and method for bonding a semiconductor chip (die) to a wafer. Background technique [0002] With the development of semiconductor technology, semiconductor chips become smaller and smaller. However, more functions must be integrated in the semiconductor chip. Therefore, semiconductor chips must have more and more input / output (I / O) pads formed in a smaller area and the density of the I / O pads is also rapidly increasing. As a result, the packaging of semiconductor chips becomes more difficult and seriously affects the yield. [0003] Packaging technology can be divided into two types. One type is commonly referred to as wafer level package (WLP), where the chips on the wafer are packaged prior to the dicing process. WLP technology has certain advantages. For example, greater capacity and lower costs. Furthermore, less under-fill and / or molding compound is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50
CPCH01L2924/01013H01L2924/01033H01L24/83H01L24/75H01L2224/83801H01L2924/01076H01L21/67092H01L2224/81894H01L24/95H01L2224/75H01L2224/7598H01L2924/01029H01L2224/83894H01L2924/01006H01L2224/75315H01L2224/81001H01L2924/14H01L2224/81005H01L2924/181H01L2924/00
Inventor 吴文进邱文智余振华
Owner TAIWAN SEMICON MFG CO LTD