Surface wave device encapsulation structure

Abstract

A surface wave device encapsulation structure belongs to the technical field of electronic components. The surface wave device encapsulation structure comprises a tellite, a chip, a protective cap and a housing; the chip is arranged on the tellite and is electrically connected with the tellite, the protective cap is combined on the tellite, a cap cavity of the protective cap corresponds to the chip, and the housing is combined on the tellite and shields the protective cap. The surface wave device encapsulation structure has the advantages that the surface wave device encapsulation structure can adapt to the flexible and changeable design, can ensure the reliability of a surface wave device, and can shorten the production process and simply the process, thus reducing the volume of the device and remarkably improving the qualification rate; the design of a device manufacturer can get rid of the situation of being restricted by a ceramic package manufacturer; the recommended surface wave device encapsulation structure can satisfy the installation requirement of the surface paster.

Description

technical field [0001] The invention belongs to the technical field of electronic components, and in particular relates to a package structure of a surface wave device. Background technique [0002] As is well known in the industry, a surface wave device is a device that uses surface waves to perform analog processing on electrical signals, and its frequency range is about 10 7 ~10 9 Hey, its working principle is: the electrical signal is converted into an acoustic signal (surface acoustic wave), propagates for a certain distance in the medium, reaches the receiving interdigital transducer, and then converts it into an electrical signal. The processing is carried out in order to obtain the output signal of the analog processing of the input signal. [0003] There are mainly but not limited to the following two forms of surface wave device structure in the prior art: one is a metal shell package structure; the other is a ceramic shell package structure. In contrast, surfac...

AI Technical Summary

Problems solved by technology

However, since surface wave devices with ceramic packaging structures require rigorous design and sintering of the ceramic shell, the sintering must be achieved with the help of a dedicated kiln, and the process is long and the qualified rate of finished products is relatively low, resulting in The following technical problems: First, the cost of devices is high, and the cost of surface wave device manufacturers is often controlled by manufacturers of ceramic shells, which confuses market competition due to the involuntary and unpredictability of device prices; The structural design of the wave device is also restricted by the structure of the ceramic shell

Therefore, the manufacture and application of surface wave devices are limited by the professional ceramic shell production process

[0004] In view of the above factors, if a surface wave device with a metal shell package structure is used, although it has the advantages of low price, it cannot be suitable for the surface mount process because of its bulky size and because the chip is connected to the pins by welding wire.

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