Method for manufacturing holographic mother board by using electroforming imposition

A holographic and mastering technology, applied in the holographic field, can solve problems such as complex process, large influence of human factors, difficult cutting and splicing accuracy, and achieve the effect of high splicing accuracy and fast splicing speed

Inactive Publication Date: 2010-01-06
HUBEI XINGLONG PACKAGING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the softness of the silica gel, it is difficult to control the cutting and splicing accuracy, and the imposition cycle is also very long (because the silica gel replication of each unit holographic pattern generally takes 24 h...

Method used

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  • Method for manufacturing holographic mother board by using electroforming imposition
  • Method for manufacturing holographic mother board by using electroforming imposition
  • Method for manufacturing holographic mother board by using electroforming imposition

Examples

Experimental program
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Embodiment

[0029] Example: Making a large-size holographic master of a hologram of a soft-packed cigarette packet

[0030] Task requirements: It is required that the effective molding area of ​​the spliced ​​holographic master is 775×619.8mm, the size of the unit holographic pattern (that is, the small cigarette case) is 155×103.3mm, a total of 30 unit holographic patterns, forming a 5×6 The matrix of the unit holographic graphics, plus the size of the holographic master after the frame is 1000×800mm, the purpose of the frame (trimmed nickel plate) is to meet the requirements of subsequent processes, such as electroforming or molding.

[0031] The manufacturing method is:

[0032] 1. Copy 30 pieces of holographic patterns (that is, unit holographic patterns) of small cigarette packs by electroforming, that is, copy 30 nickel plates with holographic patterns of small cigarette packs. The thickness of the nickel plates can be selected to be about 55 microns, but each The thickness differe...

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Abstract

The invention relates to a method for manufacturing a holographic mother board by using an electroforming imposition, which is used for big-size unit holographs. The method comprises the following steps: firstly, fixing a plurality of nickel boards of unit holographs on a flat plastic bottom board by using double-faced adhesive tapes, and then, eliminating spliced joints between every two nickel boards of the unit holographs to manufacture a big-size holographic mother board. The invention has the advantages that the method can be used for splicing a large holographic mother board containing unit holographs in different unit sizes, the splicing speed is quick, the splicing precision is high, and the subsequent electroforming process can level up and eliminate the joints, thus the nickel boards can be combined together to form an ideal large holographic mother board.

Description

technical field [0001] The invention belongs to the field of holographic technology, in particular to a method for manufacturing a holographic mother plate by electroforming imposition for large-scale unit holographic patterns. Background technique [0002] At present, the technologies used for imposition at home and abroad can basically be divided into two categories: [0003] The first is a mechanical imposition machine for small-sized unit holograms, which uses the principle of hot stamping to splice small-sized unit holograms into a large-sized hologram master by hot stamping transfer. Due to the limitations of its principle and technology, at present, only small-sized holograms can be spliced, and the unit size is mostly within the range of 10 cm × 10 cm, and large-sized unit holograms cannot be spliced. [0004] The second is the silica gel imposition method. In principle, this method can splice large-sized unit holograms. It uses silica gel to replicate the unit hol...

Claims

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Application Information

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IPC IPC(8): B41C3/08G03H5/00
Inventor 吴婷婷汤炼
Owner HUBEI XINGLONG PACKAGING MATERIAL
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