Method and device for mounting electronic component, auxiliary substrate supply device
A technology for electronic component installation and electronic components, which is applied in the direction of electrical components, electrical components, etc., can solve the problems of longer production time and lower productivity of the main substrate, and achieve the effects of improving operating efficiency, simplifying devices, and saving time
Active Publication Date: 2010-01-06
FUJI MASCH MFG CO LTD
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Problems solved by technology
In this case, there is a problem that when applying the connection material to the sub-substrate using a dispenser or performing pin transcription, it is necessary to operate each electrode individually, and each The production time of the main board becomes longer, resulting in lower productivity
Method used
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Embodiment Construction
[0032] Below, according to Figure 1 to Figure 5 Embodiments of the electronic component mounting method and apparatus of the present invention will be described. figure 1 It is a figure which shows the module type electronic component mounting apparatus 1 which is the mounting apparatus of this invention. In addition, the front, back, left, right, up, down and X, Y, Z marks in the text are in the drawings.
[0033] In this embodiment, in the electronic component mounting apparatus 1, one electronic component mounting module 2 and a plurality (in this embodiment, seven) electronic component mounting modules 3 are arranged adjacently and side by side on the base 13, so that An electronic component mounting line is constituted, wherein the one electronic component mounting module 2 is used to mount the sub-substrate S on which the connecting material has been applied on the main substrate M, and the plurality of electronic component mounting modules 3 are used to mount the sub-...
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A device for mounting an electronic component is capable of answering a sudden variation of a production method in a short time to improve the production efficiency. In the device (1) for mounting the electronic component having a substrate conveyer (5) for conveying a main substrate (M) coated with connecting material to a mounting position and a mounting head section (11) for mounting the electronic component on the main substrate (M) locating on the substrate conveyer (5), an auxiliary substrate (S) is mounted on the main substrate (M) carried to the mounting position by the mounting head section (11), the auxiliary substrate (S) is supplied by an auxiliary substrate supply device (32) for supplying the auxiliary substrate (S) to be mounted on the main substrate (M) and is in request to mount the electronic component (P) or coat the connecting material.
Description
technical field [0001] The present invention relates to an electronic component mounting device having a function of mounting a sub-board on a main board. Background technique [0002] Conventionally, when loading a module substrate, which is a module component by mounting required components on a sub-substrate, on a main substrate, the manufactured module substrate is preselected and stored, and taken out and loaded when necessary. [0003] In addition, Patent Document 1 discloses an electronic component mounting apparatus that applies cream solder to a circuit board and mounts electronic components with a single device. Regarding the electronic component mounting device described in Patent Document 1, as in Patent Document 1, figure 1 As shown, the circuit board 7 held on the Y table 6 reciprocates in the Y direction perpendicular to the direction (X direction) in which the mounting head 5 and the coating head 4 reciprocate, and passes through the coating head. 4. After ...
Claims
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IPC IPC(8): H05K13/04H05K13/02
Inventor 茑宏渡边智弘
Owner FUJI MASCH MFG CO LTD