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Method for manufacturing double-side hollowed-out plates

A manufacturing method and technology of hollow boards, which are applied in the manufacture of printed circuits, printed circuits, electrical components, etc., can solve the problems of increased manufacturing costs, high defective lines, and difficult production, and achieve the effect of reducing the defective rate of finished products

Inactive Publication Date: 2011-04-06
靖江亚星进出口有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The production process, especially during hot pressing, is prone to foreign matter and residual glue, which makes the circuit production very difficult, the circuit defect is high, and the manufacturing cost is increased.

Method used

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  • Method for manufacturing double-side hollowed-out plates
  • Method for manufacturing double-side hollowed-out plates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] (1). Copper foil cutting, cutting the copper foil into 250mm*350mm double-sided copper foil;

[0057] (2). Drilling; NC (numerical control) drilling on the double-sided copper foil in step (1), that is, drilling with an NC drilling machine;

[0058] (3). Chemical research: surface chemical treatment on the surface of copper foil; that is, chemical research on the surface of copper foil to remove foreign matter on the surface, clean the surface of copper foil, and increase the bonding force between the cover film and copper foil;

[0059] (4). Dry film lamination; the dry film is laminated on the upper surface of the first layer of copper foil, and the dry film used is Dupont 20;

[0060](5). Sticking the cover film: Align the holes of the double-sided copper foil, stick the cover film on the lower surface of the second layer of copper foil, and perform pre-pressing. The cover film used is PI (polyimide) cover film;

[0061] (6). Hot press cover film: heat press the cop...

Embodiment 2

[0075] (1). Copper foil cutting, cutting the copper foil to a double-sided copper foil with a length of 250mm*350mm;

[0076] (2). Drilling; NC (numerical control) drilling on the double-sided copper foil in step (1), that is, drilling with an NC drilling machine;

[0077] (3). Chemical research: surface chemical treatment on the surface of copper foil; that is, chemical research on the surface of copper foil to remove foreign matter on the surface, clean the surface of copper foil, and increase the bonding force between the cover film and copper foil;

[0078] (4). Dry film lamination; the dry film is laminated on the upper surface of the first layer of copper foil, and the dry film used is Dupont 20;

[0079] (5). Sticking the cover film: Align the holes of the double-sided copper foil, stick the cover film on the lower surface of the second layer of copper foil, and perform pre-pressing. The cover film used is PI (polyimide) cover film;

[0080] (6). Hot press cover film: ...

Embodiment 3

[0094] (1). Copper foil cutting, cutting the copper foil into a double-sided copper foil with a length of 250mm*350mm;

[0095] (2). Drilling; NC (numerical control) drilling on the double-sided copper foil in step (1), that is, drilling with an NC drilling machine;

[0096] (3). Chemical research: surface chemical treatment on the surface of copper foil; that is, chemical research on the surface of copper foil to remove foreign matter on the surface, clean the surface of copper foil, and increase the bonding force between the cover film and copper foil;

[0097] (4). Dry film lamination; the dry film is laminated on the upper surface of the first layer of copper foil, and the dry film used is Dupont 20;

[0098] (5). Sticking the cover film: Align the holes of the double-sided copper foil, stick the cover film on the lower surface of the second layer of copper foil, and perform pre-pressing. The cover film used is PI (polyimide) cover film;

[0099] (6). Hot press cover film...

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Abstract

The invention discloses a method for manufacturing double-side hollowed-out plates. The method comprises the following steps: copper foil cutting; boring; chemical grinding; dry film laminating, wherein a dry film is laminated on the upper surface of a first layer of copper foil; cover film pasting, wherein a double-side copper foil is aligned and a cover film is pasted on the lower surface of a second layer of copper foil for prepressing; cover film heat pressing; baking; second chemical grinding; dry film laminating, wherein a layer of dry film is laminated on the surface of the cover film of the second layer of copper foil pressed with the cover film; exposure; developing; film stripping; third chemical grinding; second cover film pasting, wherein the double-side copper foil is alignedand a cover film is pasted on the upper surface of the first layer of copper foil; second cover film heat pressing; and subsequent steps. The manufacturing method has the advantages that before the cover film is pressed on the copper foil through heat pressing, the dry film is laminated on the other surface of the copper foil to protect copper surfaces, thereby preventing the generation of foreign bodies during cover film pasting and heat pressing which affects line yield; meanwhile, copper foil thickness is increased in advance to greatly reduce copper foil corrugation during manufacturing; moreover, the method effectively reduces the fraction defective of the finished products of hollowed-out plates.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, and more specifically, relates to a method for manufacturing a double-sided hollow board. Background technique [0002] In a flexible printed circuit board (Flexible Printed Circuit board, referred to as FPC), generally speaking, the FPC substrate used to make a flexible printed circuit board includes a dielectric layer and a conductive layer covering the surface of the dielectric layer. For a single-sided FPC substrate In general, the conductive layer is only covered on one side of the dielectric layer; in double-sided FPC substrates, the conductive layer is covered on both sides of the dielectric layer; usually, the hollow board is used as one of the printed circuit boards, through Press the cover film on both sides of the copper foil, and punch out a partial hollow pattern on the circuit board through the stamping process. The hollow board FPC substrate has only a conductive...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 邓柏林魏海琴
Owner 靖江亚星进出口有限公司