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Die equipment

A technology for equipment and molds, applied in the field of mold equipment used in the process of manufacturing wafer-level lenses, can solve problems such as prolonged working hours, reduced productivity, and increased production costs, and achieve the effect of increasing operability and saving production time.

Inactive Publication Date: 2010-02-10
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current initial mold usually only has one initial mold core, and it is necessary to control the moving direction of the initial mold core to manufacture the array when manufacturing the matrix core. The life of the initial mold core increases the production cost

Method used

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Embodiment Construction

[0011] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0012] see figure 1 , figure 2 and image 3 , the mold equipment 10 provided by the embodiment of the present invention includes a mold base 20, a first cushion block 31, a second cushion block 32, a first mold core 41, a second mold core 42 and the first cushion block 31 and the The second spacer 32 is connected to the first coupling piece 50 of the mold base 20 .

[0013] The X direction, the Y direction and the Z direction are perpendicular to each other.

[0014] Specifically, the mold base 20 includes a horizontal portion 21 and a vertical portion 22 perpendicular to each other, and the horizontal portion 21 and the vertical portion 22 are connected to form an L shape.

[0015] The first spacer 31 and the second spacer 32 have the same structure and are rectangular parallelepiped, and can fit against the mold base 20 . The first block 31 has a surf...

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PUM

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Abstract

The invention provides die equipment for manufacturing female die cavities used for stamping and molding lenses. The die equipment comprises a die holder, a plurality of cushion blocks, a plurality ofdie cavities and a first connector, wherein each die cavity is provided with a molding surface in the curved surface shape of a lens, and the die cavities are connected with the cushion blocks; the first connector is used for connecting the cushion blocks with the die holder and adjusting the position of the cushion blocks to ensure that the molding surfaces of the die cavities reach preset positions.

Description

technical field [0001] The invention relates to a mold device for manufacturing lenses, in particular to a mold device used in the process of manufacturing wafer-level lenses. Background technique [0002] At present, more and more miniaturized lens modules are used in consumer electronic products such as mobile phones, personal digital assistants, and notebook computers. How to manufacture miniaturized lens modules has become a research topic for researchers. The prior art provides a wafer-level lens manufacturing method, which mainly uses imprinting technology to imprint the lens on the wafer, and then combines the related technology of the semiconductor process to electrically conduct the lens and the image sensor. Connection, stacking, integration and packaging with other optical components. Generally, thousands of optical lens modules can be manufactured on an 8-inch wafer. [0003] In the manufacturing process of wafer-level lenses, the mold equipment for embossing l...

Claims

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Application Information

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IPC IPC(8): C03B11/06
Inventor 张耕铭
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD