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Communication method for CLF chip and SIM card

A communication method and signal technology, which is applied in the field of communication, can solve the problem of S2 signal not being transmitted, and achieve the effect of reducing product cost and working stably

Inactive Publication Date: 2011-08-17
INST OF ACOUSTICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to overcome the problem that the S1 signal of the prior art SWP scheme cannot be transmitted when the S1 signal is at a low level, the present invention provides a communication method between the CLF and the SIM card

Method used

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  • Communication method for CLF chip and SIM card
  • Communication method for CLF chip and SIM card
  • Communication method for CLF chip and SIM card

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Embodiment Construction

[0033] The communication method of CLF and SIM card that the present invention provides, the connection figure of CLF chip and SIM card and mobile phone baseband chip is as follows Image 6 Shown: C1 pin (VCC) and C5 pin (GND) of the SIM card are both connected to the CLF and the baseband chip of the mobile phone. The SIM card and CLF are powered by the baseband chip of the mobile phone. Through the C6 pin, the SIM card is connected to the CLF, and a data line (DATA) is used to realize full-duplex communication.

[0034] The signal transmitted from the CLF chip to the SIM card is defined as the S1 signal, and the signal transmitted from the SIM card to the CLF chip is defined as the S2 signal. Both S1 and S2 signals are digital voltage signals with a high level of 3V and a low level of 0V. The S1 signal adopts a voltage modulation method, and the S2 signal adopts a current modulation method (actually, it is a load modulation scheme adopted).

[0035] When the S1 signal is t...

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Abstract

The invention relates to a communication method for a CLF chip and an SIM card. The method comprises the following steps of: connecting a C6 pin of the SIM card with a DATA port of the CLF chip through a DATA wire; transmitting an S1 signal from the CLF chip to the SIM card through the DATA wire by using an S1 signal demodulation module in the SIM card and adopting a voltage modulation mode; and transmitting an S2 signal from the SIM card to the CLF chip through the DATA wire by using an S2 signal modulation part in the SIM card and an S2 signal demodulation part in the CLF chip and adopting a current modulation mode, thereby achieving the full-duplex communication of the CLF chip and the SIM card. The communication method also comprises a step of setting one S1 signal modulation module in the CLF chip, wherein the S1 signal modulation module is used for raising the low level of the S1 signal from 0 V to between 0.3 and 0.8 V so that the S2 signal can be transmitted from the SIM card to the CLF chip through the DATA wire under the condition that the S1 signal is at a low level or a high level.

Description

technical field [0001] The invention relates to the communication field, in particular to a communication method between a CLF and a SIM card. Background technique [0002] SIM card interface: The SIM card pin definition complies with the ISO7816 identification card specification for integrated circuit cards with contacts. The SIM card pins are defined in the ISO7816 specification, such as figure 1 shown. Among them, the five pins C1, C2, C3, C5, and C7 are conventional SIM card pins; C6 is defined as VPP high-voltage programming pin, which has lost its function; C4 and C8 have been extended by the International Standards Organization to a new generation of SIM cards USB interface. The connection between the SIM card and the CLF chip needs to find a solution within the above 8 pins. [0003] The SWP solution is a connection solution for connecting CLF and UICC (SIM card) proposed by Gemalto Company. It is a CLF single-wire connection using the C6 pin of the SIM card, su...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K7/00
Inventor 王琪王东辉李云岗
Owner INST OF ACOUSTICS CHINESE ACAD OF SCI
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