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Semiconductor die support in an offset die stack

A semiconductor and bare chip technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of thickness reduction and damage to the upper bare chip, etc.

Inactive Publication Date: 2010-03-03
SANDISK CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the thickness of the semiconductor die has been significantly reduced, the pressure exerted by the wire bonding capillary during wire bonding can crack or otherwise damage the upper die

Method used

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  • Semiconductor die support in an offset die stack
  • Semiconductor die support in an offset die stack
  • Semiconductor die support in an offset die stack

Examples

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Embodiment Construction

[0028] will now refer to Figures 3 to 15 The description relates to embodiments of a semiconductor package and a method of forming the semiconductor package. It should be understood that this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the invention to those skilled in the art. Indeed, the invention is intended to cover alternatives, modifications and equivalents of these embodiments, which are included within the scope and spirit of the invention as defined by the appended claims. Furthermore, in the following detailed description of the invention, numerous specific details are set forth in order to provide a thorough understanding of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without such specific details. ...

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Abstract

A semiconductor device is disclosed including a support structure for supporting an edge of a semiconductor die that is not supported on the substrate or semiconductor die below. In embodiments, the semiconductor device may in general include a substrate having a plurality of contact pads, a first semiconductor die mounted on the substrate, and a second semiconductor die mounted on the first semiconductor die in an offset configuration so that an edge of the second semiconductor die overhangs the first semiconductor die. A support structure may be affixed to one or more of the contact pads beneath the overhanging edge to support the overhanging edge during a wire bonding process which exerts a downward force on the overhanging edge.

Description

technical field [0001] Embodiments of the present invention relate to a low profile semiconductor device and a method of manufacturing the low profile semiconductor device. Background technique [0002] The strong growth in demand for portable consumer electronic devices is driving the need for high capacity storage devices. Non-volatile semiconductor memory devices, such as flash memory memory cards, are becoming widely used to meet the ever-increasing demand for digital information storage and exchange. The portability, versatility, and rugged design of such memory devices, together with their high reliability and large capacity, have made them ideal for use in a wide variety of electronic devices, including, for example, digital cameras, digital Music players, video game consoles, PDAs, and cellular phones. [0003] While a wide variety of packaging configurations are known, flash memory memory cards can typically be fabricated as a system-in-package (SiP) or a multi-ch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/065H01L23/48H01L23/12
CPCH01L25/0657H01L2924/01082H01L2225/06586H01L2924/01004H01L2224/97H01L2224/32245H01L24/32H01L2924/01322H01L2924/01029H01L2224/48091H01L2924/014H01L2924/01013H01L2224/32225H01L2224/48225H01L2224/92247H01L24/97H01L2924/0665H01L2224/83191H01L2224/2919H01L2924/1815H01L24/33H01L2924/01047H01L2224/85186H01L2924/01079H01L2224/838H01L2224/48247H01L2224/48227H01L2924/19107H01L24/83H01L2924/01033H01L2224/32145H01L2225/0651H01L2924/01078H01L24/92H01L2224/73265H01L2225/06562H01L2224/85181H01L2924/181H01L2224/05554H01L24/73H01L2224/023H01L2924/00014H01L2224/85H01L2224/83H01L2924/00H01L2924/3512H01L2924/00012H01L2924/0001H01L23/12
Inventor 邱锦泰赫姆·塔基阿尔习佳清
Owner SANDISK CORP
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