Method for manufacturing printed wiring board
A technology for printed wiring boards and manufacturing methods, applied in printed circuit manufacturing, printed circuit, multi-layer circuit manufacturing, etc., can solve difficult waste liquid treatment and other problems, and achieve the effect of easy waste liquid treatment and stain removal
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[0027] The present invention is applicable to a method of manufacturing a printed wiring board in which holes are formed by irradiating laser light on a multilayer laminated resin layer and copper layer. The laser processing method is not particularly limited, and for example, well-known processing methods such as a conformal mask method and a direct laser method can be used. In addition, there is no particular limitation on the hole to be formed. For example, well-known holes such as blind holes or through holes can be applied. However, since blind holes tend to leave stains at the bottom of the hole, it can be more effective. Bring into play the effect of the present invention.
[0028] Hereinafter, when forming blind holes by a direct laser method, an example to which the present invention is applied will be described as an example of the present invention with reference to the drawings. referenced Figure 1A , Figure 1B as well as Figure 2A ~ Figure 2C It is a cross-...
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