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Anisotropic conductive material

A conductive material and anisotropic technology, applied in the field of anisotropic conductive polymer material composition, can solve the problems of complicated manufacturing process and impracticality, and achieve the effect of convenient operation

Inactive Publication Date: 2012-01-18
冠品材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, since pre-sealing must be performed with UV-curable resin, the manufacturing process is complicated and impractical

Method used

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  • Anisotropic conductive material
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Embodiment Construction

[0045] The present invention relates to a unique anisotropic conductive material composition that can be used to bond two electronic components or two conductive surfaces together. refer to Figure 7 , the anisotropic conductive material of the present invention (not shown) fills up the gap between the substrate surface A to be bonded and the substrate surface B to be bonded, and the substrate surface A to be bonded and the substrate surface to be bonded A bump 70 may be provided on the substrate surface B, and such a structure is common in the field of thin film transistor liquid crystal displays. The anisotropic conductive material of the present invention can allow electrical conduction in the z-direction or thickness direction without causing electrical conduction in the x-direction or y-direction (the x-direction or y-direction is substantially parallel to the surface of the substrate to be bonded) , and the z direction is perpendicular to the surface of the substrate to...

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Abstract

The invention provides an anisotropic conductive material. Basic components of the anisotropic conductive material comprise thermosetting epoxy resin and ultra-fine filamentous nickel powder mixed in the thermosetting epoxy resin. The ultra-fine filamentous nickel powder has a unique three-dimensional chainlike network structure, and can be dispersed in a macromolecular film of epoxy resin and the like so that the macromolecular film has anisotropic electric conductivity.

Description

technical field [0001] The invention relates to conductive materials, in particular to an anisotropic conductive polymer material composition. Background technique [0002] Due to the rapid development of science and technology, all kinds of consumer electronic products are developing towards light, thin, short, and small. It also makes all electronic product manufacturers work together to improve the precision of the connection between various electronic components in electronic products, so as to improve product reliability and product yield. [0003] The traditional method of connecting various electronic components in electronic products is usually by soldering, which has the advantages of easy operation and a certain degree of reliability. However, due to the ever-increasing spacing between circuit components, traditional soldering techniques are no longer adequate. In some special occasions, it must be replaced by various anisotropic conductive materials with differe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/06C08L63/00H01B1/22C08K3/08
Inventor 叶嗣韬
Owner 冠品材料科技股份有限公司