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Bus T-type head device and manufacturing method thereof

A manufacturing method and bus technology, applied in the direction of coupling device, connecting device components, and contact assembly/disassembly, etc., can solve problems such as desoldering and virtual connection of circuit solder joints, so as to reduce connection time and improve standardization. Effect

Inactive Publication Date: 2010-03-17
BEIHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, in the process of bus-type hardware wiring, with the increase of access nodes, cross-connection of signal cables often occurs, and the welding points of the lines increase accordingly. During testing and use, it may be due to external force or the weight of the signal line itself. Leading to the hidden danger of solder joint virtual connection and desoldering

Method used

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  • Bus T-type head device and manufacturing method thereof
  • Bus T-type head device and manufacturing method thereof
  • Bus T-type head device and manufacturing method thereof

Examples

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Embodiment Construction

[0031] The present invention is a bus T-head device and its manufacturing method. The present invention will be further described below in conjunction with the accompanying drawings.

[0032] (1) see total figure 1 As shown, a bus T-shaped head device of the present invention is composed of a box body 1, a bottom box 2, an aviation plug 3, and a screw 4. After the socket 5 on the aviation plug 3 is welded with the signal line 8, the socket 5 is screwed 4 is fixed on the box body 1, and the box body 1 is set on the bottom box 2 and fixed with screws 4.

[0033] The box body 1, such as figure 2 As shown, it is a five-sided hollow box without a bottom. On the upper bottom, left side, and right side of the box body 1, there are four Φ3.2mm holes centered on a Φ15mm hole, and two Φ3.2mm connected small holes are opened in the lower part of the front and back, and the wall thickness is 1.2mm. mm. The size of this example is determined by the MY10X14J4A / Q aviation plug.

[003...

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PUM

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Abstract

The invention relates to a bus T-type head device, consisting of a box body, a bottom box, an aerial plug and screws, wherein a socket is welded on a signal cable, and the socket is fixed on the box body through a screw; the box body is sheathed on the bottom box and is fixedly connected by a screw. The box body is hollow with five surfaces and no bottom surface; the bottom box is provided with six column bodies which are protruded on a bottom plate; the aerial plug consists of the socket, a plug and a tail attach; the screws are standard connectors. A manufacturing method of the bus T-type head device has seven steps: 1. purchasing and inspecting raw materials; 2. using metallic aluminium plates to process the box body and the bottom box; 3. carrying out anodizing treatment on the box body and the bottom box; 4. welding the aerial plug; 5. conducting test; 6. assembling and connecting the screws; and 7. testing tensile strength of the bus T-type head. The bus T-type head device can lead hardware personnel to distribute wires fast according to the specific requirements, effectively reduce the connecting time of the hardware wires, and improve the standardability, reliability and easy maintenance of the hardware wires. In addition, the invention has wide practical value and application prospect.

Description

1. Technical field: [0001] The invention relates to a bus T-shaped head device and a manufacturing method thereof, belonging to the technical field of hardware, and specifically relates to T-shaped head model design, processing, socket welding and the like. 2. Background technology: [0002] The T-shaped head is composed of a box body and a bottom box, aviation plugs and screws. It is used for T-type connection of lines in hardware wiring, and can be connected in series or in parallel according to wiring requirements. The wiring method is flexible and eliminates welding work during wiring. [0003] At present, in the process of bus-type hardware wiring, with the increase of access nodes, cross-connection of signal cables often occurs, and the welding points of the lines increase accordingly. During testing and use, it may be due to external force or the weight of the signal line itself. Leading to the hidden danger of circuit solder joint virtual connection and desoldering....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/512H01R13/518H01R43/20
Inventor 武永梅高家颍刘恺
Owner BEIHANG UNIV
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