Bus T-type head device and manufacturing method thereof
A manufacturing method and bus technology, applied in the direction of coupling device, connecting device components, and contact assembly/disassembly, etc., can solve problems such as desoldering and virtual connection of circuit solder joints, so as to reduce connection time and improve standardization. Effect
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[0031] The present invention is a bus T-head device and its manufacturing method. The present invention will be further described below in conjunction with the accompanying drawings.
[0032] (1) see total figure 1 As shown, a bus T-shaped head device of the present invention is composed of a box body 1, a bottom box 2, an aviation plug 3, and a screw 4. After the socket 5 on the aviation plug 3 is welded with the signal line 8, the socket 5 is screwed 4 is fixed on the box body 1, and the box body 1 is set on the bottom box 2 and fixed with screws 4.
[0033] The box body 1, such as figure 2 As shown, it is a five-sided hollow box without a bottom. On the upper bottom, left side, and right side of the box body 1, there are four Φ3.2mm holes centered on a Φ15mm hole, and two Φ3.2mm connected small holes are opened in the lower part of the front and back, and the wall thickness is 1.2mm. mm. The size of this example is determined by the MY10X14J4A / Q aviation plug.
[003...
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