Apparatus and method for promoting cooling of electronic device racks using a water vapor compression system

Abstract

The present invention provides an apparatus and method for facilitating cooling of electronic device racks. A cooling device for cooling electronic devices including semiconductor components, including an evaporator, a condenser, and a circulation pump and piping, the evaporator stores a coolant, evaporates the coolant under a reduced pressure lower than the ambient pressure, and generates cooled the coolant; the condenser communicates with the evaporator through a bypass line, and regenerates the coolant from the vapor of the coolant; the circulation pump and piping supply the cooled coolant to the heat exchange area of ​​the electronic device, in the electronic device On the high temperature side, heat exchange is performed with the air flow passing through the semiconductor element, and the coolant after heat exchange is returned to the condenser; in the heat exchange area with the air flow, the pressure of the coolant is kept lower than the ambient pressure.

Description

technical field [0001] The present invention relates to water cooling technology for electronic devices, and more particularly, to devices and methods for cooling electronic devices, coolant-shielded electronic devices, and methods for cooling electronic devices. Background technique [0002] Typically, electronic devices including such as personal computers, servers, workstations and / or mainframe computers require cooling devices for cooling heat sources such as microprocessor units (hereinafter referred to as MPU) or central processing units (hereinafter referred to as CPU), In order to maintain its stable performance. Recently, there has been an increasing need to operate electronic devices with high performance and high clock rates, so that heat generation from electronic devices has created new problems in computing technology in addition to old problems. [0003] The problem is precisely the heat generation of MPUs and / or CPUs, and there are technical predictions that...

AI Technical Summary

Problems solved by technology

Well, since corrosion and its scale substantially depend on the specific environment in which the electronic device is installed, it is practically impossible to prevent the occurrence of problems caused by corrosion under various conditions

[0020] In addition, in addition to corrosion, factors causing water leakage include, for example, cuts or breakages caused by impacts and loose joint connections, so it is difficult to solve the above-mentioned various factors and overcome adverse effects while considering all the above-mentioned factors

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