Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Apparatus and method for promoting cooling of electronic device racks using a water vapor compression system

A technology of electronic devices and coolants, applied in the direction of cooling/ventilation/heating transformation, circuits, electrical components, etc., can solve problems such as unpreventable, split or damaged, loose, etc., and achieve the effect of minimizing the possibility

Inactive Publication Date: 2011-12-28
INT BUSINESS MASCH CORP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Well, since corrosion and its scale substantially depend on the specific environment in which the electronic device is installed, it is practically impossible to prevent the occurrence of problems caused by corrosion under various conditions
[0020] In addition, in addition to corrosion, factors causing water leakage include, for example, cuts or breakages caused by impacts and loose joint connections, so it is difficult to solve the above-mentioned various factors and overcome adverse effects while considering all the above-mentioned factors

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Apparatus and method for promoting cooling of electronic device racks using a water vapor compression system
  • Apparatus and method for promoting cooling of electronic device racks using a water vapor compression system
  • Apparatus and method for promoting cooling of electronic device racks using a water vapor compression system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0062] figure 1 A data center control system of electronic devices implementing the apparatus, methods and shields is generally shown. The data center control system 100 includes a CARC 110 , a plurality of electronic devices 120 - 150 , and an automatic environmental monitoring facility (hereinafter, referred to as AOEMF) 160 . The aforementioned devices are placed on a floor 170 which is separated from the floor to provide space for utility piping. The floor 170 has a perforated portion that introduces cooling air supplied through the space.

[0063] The CRAC 110 performs air conditioning and thermal management of the devices in the computing room 195 . The CRAC 110 receives cooled coolant from the building backbone air conditioning system through supply line 118 . Air in computing room 195 is introduced into CARS 110 by fan 112 and returned to computing room 195 after heat exchange in heat exchanger 114 .

[0064] In the heat exchanger 114, cooled coolant such as water...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides an apparatus and method for facilitating cooling of electronic device racks. A cooling device for cooling electronic devices including semiconductor components, including an evaporator, a condenser, and a circulation pump and piping, the evaporator stores a coolant, evaporates the coolant under a reduced pressure lower than the ambient pressure, and generates cooled the coolant; the condenser communicates with the evaporator through a bypass line, and regenerates the coolant from the vapor of the coolant; the circulation pump and piping supply the cooled coolant to the heat exchange area of ​​the electronic device, in the electronic device On the high temperature side, heat exchange is performed with the air flow passing through the semiconductor element, and the coolant after heat exchange is returned to the condenser; in the heat exchange area with the air flow, the pressure of the coolant is kept lower than the ambient pressure.

Description

technical field [0001] The present invention relates to water cooling technology for electronic devices, and more particularly, to devices and methods for cooling electronic devices, coolant-shielded electronic devices, and methods for cooling electronic devices. Background technique [0002] Typically, electronic devices including such as personal computers, servers, workstations and / or mainframe computers require cooling devices for cooling heat sources such as microprocessor units (hereinafter referred to as MPU) or central processing units (hereinafter referred to as CPU), In order to maintain its stable performance. Recently, there has been an increasing need to operate electronic devices with high performance and high clock rates, so that heat generation from electronic devices has created new problems in computing technology in addition to old problems. [0003] The problem is precisely the heat generation of MPUs and / or CPUs, and there are technical predictions that...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/427H05K7/20G06F1/20
Inventor R·R·施密特高吉顺二塚本刚史船津正义小内实今井正昭井上良则
Owner INT BUSINESS MASCH CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com