Device and method for promotion of cooling electronic device rack by using a vapor compression system

A technology of electronic devices and coolants, applied in the direction of cooling/ventilation/heating transformation, circuits, electrical components, etc., can solve problems such as unpreventable, split or damaged, loose, etc., and achieve the effect of minimizing the possibility
CN101677091AInactive Publication Date: 2010-03-24IBM CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
IBM CORP
Publication Date
2010-03-24
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention provides a device and method for the promotion of cooling electronic device rack by using a vapor compression system. A cooling device used to cool the electronic device including semiconductor elements is provided with an evaporator, a condenser, a circulating pump and tubing, wherein the evaporator stores coolant which will be evaporated when the pressure is lower than thesurrounding pressure so as to generate cooled coolant; the condenser is communicated with with the evaporator by a bypass pipleline to regenerate the coolant from coolant steam; the circulating pump and piping are used to supply the cooled coolant to a heat exchange area of the electronic device, so as to exchange heat with an air flow passing through the semiconductor elements and return the coolant after heat exchange to the condenser on a high-temperature side of the electronic device; In the heat exchange area of the air flow, the pressure of the coolant is ensured to be lower than the surrounding pressure.
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Description

technical field

[0001] The present invention relates to water cooling technology for electronic devices, and more particularly, to devices and methods for cooling electronic devices, coolant-shielded electronic devices, and methods for cooling electronic devices. Background technique

[0002] Typically, electronic devices including such as personal computers, servers, workstations and / or mainframe computers require cooling devices for cooling heat sources such as microprocessor units (hereinafter referred to as MPU) or central processing units (hereinafter referred to as CPU), In order to maintain its stable performance. Recently, there has been an increasing need to operate electronic devices with high performance and high clock rates, so that heat generation from electronic devices has created new problems in computing technology in addition to old problems.

[0003] The problem is precisely the heat generation of MPUs and / or CPUs, and there are technical predictions that...

Claims

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