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Device and method for promotion of cooling electronic device rack by using a vapor compression system

A technology of electronic devices and coolants, applied in the direction of cooling/ventilation/heating transformation, circuits, electrical components, etc., can solve problems such as unpreventable, split or damaged, loose, etc., and achieve the effect of minimizing the possibility

Inactive Publication Date: 2010-03-24
IBM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Well, since corrosion and its scale substantially depend on the specific environment in which the electronic device is installed, it is practically impossible to prevent the occurrence of problems caused by corrosion under various conditions
[0020] In addition, in addition to corrosion, factors causing water leakage include, for example, cuts or breakages caused by impacts and loose joint connections, so it is difficult to solve the above-mentioned various factors and overcome adverse effects while considering all the above-mentioned factors

Method used

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  • Device and method for promotion of cooling electronic device rack by using a vapor compression system
  • Device and method for promotion of cooling electronic device rack by using a vapor compression system
  • Device and method for promotion of cooling electronic device rack by using a vapor compression system

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Embodiment Construction

[0062] figure 1 A data center control system of electronic devices implementing the apparatus, methods and shields is generally shown. The data center control system 100 includes a CARC 110 , a plurality of electronic devices 120 - 150 , and an automatic environmental monitoring facility (hereinafter, referred to as AOEMF) 160 . The aforementioned devices are placed on a floor 170 which is separated from the floor to provide space for utility piping. The floor 170 has a perforated portion that introduces cooling air supplied through the space.

[0063] The CRAC 110 performs air conditioning and thermal management of the devices in the computing room 195 . The CRAC 110 receives cooled coolant from the building backbone air conditioning system through supply line 118 . Air in computing room 195 is introduced into CARS 110 by fan 112 and returned to computing room 195 after heat exchange in heat exchanger 114 .

[0064] In the heat exchanger 114, cooled coolant such as water...

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Abstract

The present invention provides a device and method for the promotion of cooling electronic device rack by using a vapor compression system. A cooling device used to cool the electronic device including semiconductor elements is provided with an evaporator, a condenser, a circulating pump and tubing, wherein the evaporator stores coolant which will be evaporated when the pressure is lower than thesurrounding pressure so as to generate cooled coolant; the condenser is communicated with with the evaporator by a bypass pipleline to regenerate the coolant from coolant steam; the circulating pump and piping are used to supply the cooled coolant to a heat exchange area of the electronic device, so as to exchange heat with an air flow passing through the semiconductor elements and return the coolant after heat exchange to the condenser on a high-temperature side of the electronic device; In the heat exchange area of the air flow, the pressure of the coolant is ensured to be lower than the surrounding pressure.

Description

technical field [0001] The present invention relates to water cooling technology for electronic devices, and more particularly, to devices and methods for cooling electronic devices, coolant-shielded electronic devices, and methods for cooling electronic devices. Background technique [0002] Typically, electronic devices including such as personal computers, servers, workstations and / or mainframe computers require cooling devices for cooling heat sources such as microprocessor units (hereinafter referred to as MPU) or central processing units (hereinafter referred to as CPU), In order to maintain its stable performance. Recently, there has been an increasing need to operate electronic devices with high performance and high clock rates, so that heat generation from electronic devices has created new problems in computing technology in addition to old problems. [0003] The problem is precisely the heat generation of MPUs and / or CPUs, and there are technical predictions that...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427H05K7/20G06F1/20
Inventor R·R·施密特高吉顺二塚本刚史船津正义小内实今井正昭井上良则
Owner IBM CORP
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