Chip package structure

Abstract

The invention provides a chip packaging structure, comprising a substrate, at least one chip, a plurality of leads, a cooling component, packaging gel and at least one insulating sheet, wherein, the chip is arranged on the substrate; the leads are electrically connected with the substrate; the at least one chip, the substrate and part of leads are coated with the packaging gel which is provided with a top surface; the cooling component is arranged on top surface of the sealing gel; the at least one insulating sheet is arranged between the cooling component and at least one lead, and provided with a bending line which divides the at least one insulating sheet into a body arranged on the packaging gel and a buckling part extended from the body.

Description

technical field [0001] The present invention relates to a chip packaging structure, and in particular to a chip packaging structure with high voltage protection. Background technique [0002] When designing a chip package structure that requires high voltage input (such as a power module that controls the power supply or an IGBT module that controls the motor drive), in order to comply with safety standards (such as: UL Standard) and ensure the normal operation of the package structure, it is usually necessary Consider the creepage distance and clearance distance between the voltage input terminal (such as a lead) of the package structure and the metal material (such as a heat sink) to avoid conduction between the lead and the heat sink This results in an electrical short circuit and prevents the instantaneous high voltage input from the pin from directly jumping to the low voltage end (ie, the heat dissipation component), thereby endangering the safety of users. [0003] ...

AI Technical Summary

Problems solved by technology

[0004] However, the cooling fins 110 with a special shape can only be produced by using a specially designed mold, therefore, the manufacturing cost of the cooling fins 110 is relatively high

In addition, when designing the components inside the encapsulant 140 (such as the bonding wire 150, the chip 160, the substrate 130, and some leads 120), the position of the aforementioned components should avoid the groove 142, so as to avoid the groove 142 exposing the aforementioned components. , so the design freedom of the aforementioned components is small

[0005] In addition, U.S. Patent No. 5,672,910 discloses the use of a flat insulating sheet covering the heat sink to increase the creepage distance and space distance, but too long a flat insulating sheet will affect the convection of the heat sink and increase the volume of the package structure; while the U.S. invention The packaging structures disclosed in Patent No. 5,698,899, Japanese Laid-Open Patent No. 06-061375 and Japanese Laid-Open Patent No. 2000-236047 cannot effectively increase the creepage distance and space distance

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