Heat radiation device

Abstract

The invention relates to a heat radiation device which is applied to a heating element and comprises a fixed heat radiation module, a heat pipe, a movable heat radiation module and at least one telescopic connection component. The fixed heat radiation module is arranged at the heating element; one end of the heat pipe is arranged at the fixed heat radiation module in a sliding way, and the other end of the heat pipe is fixed at the movable heat radiation module; and both ends of at least one of the telescopic connection components after extending are respectively connected with the movable heat radiation module and the fixed heat radiation module, the telescopic connection components comprise a plurality of assistant connection components, each assistant connection component comprises a slide rail part used for supporting and connecting the adjacent assistant connection components to lead the two adjacent assistant connection components to slide oppositely.

Description

technical field [0001] The present invention relates to a heat dissipation device, and in particular to a heat dissipation device applied to a heating element. Background technique [0002] Under the increasingly precise and complex design of electronic devices, many new issues to be solved have been extended. Among them, more and more dense integrated circuits will generate a large amount of heat energy, and heat energy will be one of the most serious problems in a small circuit space. If there is no proper mechanism to dissipate the heat outside the electronic device, the integrated circuit will not be able to withstand the heat, and thus suffer from wear and tear, affecting the performance of the entire electronic device, or even losing its function. [0003] Traditional cooling devices are mostly fixed in the host, or can only move the cooling device slightly relative to the heating element, but such a distance cannot keep the dissipated heat away from the host, and the...

AI Technical Summary

Problems solved by technology

If there is no proper mechanism to dissipate the heat outside the electronic device, the integrated circuit will not be able to withstand the heat, so it will be damaged and affect the performance of the overall electronic device, or even lose its function.

[0003] Traditional cooling devices are mostly fixed in the host, or can only move the cooling device slightly relative to the heating element, but such a distance cannot keep the dissipated heat away from the host, and there is still a great possibility that the host will be damaged. still have an impact

Such a design cannot effectively remove heat energy from the electronic device. If there is no more efficient way to remove heat energy due to the more complex progress of current circuit design, it will be easy to accumulate too much heat energy in the electronic device. The circuit is overheated and damaged in the electronic device

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