Manufacture method of conducting elastic body
A manufacturing method and elastic body technology, applied in the direction of manufacturing measuring instruments, measuring electrical variables, measuring devices, etc., can solve the problems of complex manufacturing procedures and expensive conductive elastomers
Inactive Publication Date: 2011-05-18
KING YUAN ELECTRONICS
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Problems solved by technology
However, the conductive elastomers currently tested are very expensive and the manufacturing process is quite complicated
Therefore, due to cost considerations, many test factories did not actually introduce a large number of conductive elastomers into the test production line, but only tested a few specific products.
Method used
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Embodiment Construction
[0022] see Figure 1A to Figure 1J , is a schematic cross-sectional view of a preferred embodiment of a method for manufacturing a conductive elastomer of the present invention. However, the present invention uses micro-electro-mechanical technology to manufacture conductive elastomers with low cost and high efficiency. However, the present invention is not limited to the micro-electro-mechanical process, and the present invention can also be realized by using a semiconductor process or other equivalent processes. The following will describe the micro-electro-mechanical process as a preferred embodiment.
[0023] Please also see Figure 1A and image 3 As shown, firstly, a substrate 1 is provided, and a plurality of grooves 12 are pre-set on the upper surface 11 of the substrate 1 . The plurality of grooves 12 can be pre-machined by a CNC machine tool. In addition, the substrate 1 can be reused to achieve the purpose of reducing costs. Another example image 3 as shown, ...
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Abstract
The invention relates to a manufacture method of a conducting elastic body. The method comprises the following steps of: cladding a first metal sacrificial layer on a substrate with a plurality of grooves, and then forming a first photoresist layer on the first metal sacrificial layer; providing a plurality of first openings on the first photoresist layer and respectively corresponding the first openings to the grooves; then filling gel containing conducting particles into the first openings and curing the gel to form a plurality of first elastic columns; repeating the steps so as to form a second metal sacrificial layer, a second photoresist layer and a plurality of second openings, and forming a plurality of second elastic columns so as to correspond the second elastic columns above thefirst elastic columns; and finally, removing the second photoresist layer, the second metal sacrificial layer, the first metal sacrificial layer and the substrate to only remain the first photoresistlayer and the first elastic columns as well as the second elastic columns, which are dispersed in the first photoresist layer and mutually overlapped up and down.
Description
technical field [0001] The invention relates to a method for manufacturing a conductive elastic body, in particular to a method for manufacturing a conductive elastic body by using a micro-electromechanical technology. Background technique [0002] In the chip packaging and testing process, in order to save test time and cost, it is often necessary to test multiple devices under test (DUT) at one time, especially for ball grid array (BGA) and other array solder ball tests. . The means adopted by the known technology all use the design method of the probe (Pogo pin) to cooperate with the test socket (Socket) to achieve the purpose of the test. However, as technology continues to evolve and the pitch of package solder balls (Pitch) becomes smaller and smaller, the known testing methods are subject to many limitations in design and assembly, and cannot meet the existing requirements. [0003] Therefore, a conductive elastomer has been developed to replace the conventional met...
Claims
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IPC IPC(8): G01R3/00
Inventor 赵本善陈家进
Owner KING YUAN ELECTRONICS