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Electronic device and heat-radiating unit thereof

The technology of an electronic device and a heat dissipation unit is applied in the field of an electronic device with a heat dissipation unit, and can solve problems such as insufficient use of the heat dissipation system

Inactive Publication Date: 2010-06-09
GIGA BYTE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, with the advancement of technology, electronic devices generate more heat while possessing powerful functions. The general heat dissipation system is no longer sufficient. Electronic devices must be equipped with a more powerful heat dissipation mechanism in order to efficiently carry out heat dissipation. System cooling

Method used

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  • Electronic device and heat-radiating unit thereof
  • Electronic device and heat-radiating unit thereof
  • Electronic device and heat-radiating unit thereof

Examples

Experimental program
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Embodiment Construction

[0022] Such as figure 1 , the electronic device 100 of this embodiment includes a casing 110, a circuit board 120, a heat dissipation system 140, a heat dissipation unit 150 and a plurality of heating elements C, wherein the heat dissipation unit 150 is an auxiliary heat dissipation mechanism for strengthening the electronic device 100's of system cooling.

[0023] The circuit board 120 is disposed in the casing 110 , and a plurality of heating elements C are distributed on the circuit board 120 , and the heat dissipation system 140 is provided to dissipate heat from the heating elements C. The cooling system 140 includes a plurality of radiators 141 and a plurality of first heat pipes 142, wherein the number of radiators 141 is set corresponding to the number of heating elements C, in this embodiment, the heating elements C and radiators 141 are Four, but not limited to.

[0024] The radiators 141 abut against the heating element C respectively, the heat of the heating elem...

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PUM

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Abstract

The invention discloses an electronic device and a heat-radiating unit thereof. The electronic device comprises a shell, a circuit board, a heating element, a heat-radiating system and a heat-radiating unit. The circuit board is arranged in the shell; the heating element is arranged on the circuit board; the heat-radiating system supports against the heating element; and the heat-radiating unit is arranged on the shell and supports against the heat-radiating system, wherein one part of the heat-radiating unit is exposed out of the shell. The heat-radiating unit comprises a connecting part, a heat-radiating row and a heat tube; the connecting part is arranged in the shell and supports against the heat-radiating system; the heat-radiating row is arranged in the shell and one part of the heat-radiating row is exposed out of the shell; and the heat pipe is connected with the connecting part and the heat-radiating row.

Description

technical field [0001] The present invention relates to an electronic device, in particular to an electronic device with a heat dissipation unit. Background technique [0002] In a general electronic device, there will be a heat dissipation system for dissipating heat from the heating element in the electronic device. The heat dissipation system uses the radiator to directly contact the heating element, so that the heat of the heating element is transferred to the radiator, and then restarts. A system fan convects the air in the electronic device, thereby removing the heat accumulated on the heat sink. [0003] However, with the advancement of technology, electronic devices generate more heat while possessing powerful functions. The general heat dissipation system is no longer sufficient. Electronic devices must be equipped with a more powerful heat dissipation mechanism in order to efficiently carry out heat dissipation. System cooling. Contents of the invention [0004...

Claims

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Application Information

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IPC IPC(8): H05K7/20H01L23/34H01L23/427
Inventor 张世和
Owner GIGA BYTE TECH CO LTD
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