Copper alloy sheet

Abstract

The present invention relates to a Cu-Ni-Sn-P-based copper alloy sheet having a specific composition, where (1) the copper alloy sheet is set to have an electrical conductivity of 32% IACS or more, a stress relaxation ratio in the direction parallel to the rolling direction of 15% or less, a 0.2%-proof stress of 500 MPa or more and an elongation of 10% or more; (2) the X-ray diffraction intensity ratio I(200) / I(220) in the sheet surface is set to be a given value or less and at the same time, anisotropy in the stress relaxation resistance characteristic is reduced by fining the grain size; (3) the texture of the copper alloy sheet is set to a texture such that the distribution density ofB orientation and the sum of distribution densities ofB orientation, S orientation and Cu orientation each is set to fall in a specific range and bendability is thereby enhanced; or (4) the dislocation density measured using the value obtained by dividing the half-value breadth of the X-ray diffraction intensity peak from {200} plane in the copper alloy sheet surface by the peak height is set to a given value or more and press punchability is thereby enhanced. The Cu-Ni-Sn-P-based copper alloy sheet of the present invention is excellent in the properties required for a terminal or connector and further (1) has excellent strength-ductility balance, (2) satisfies the stress relaxation resistance characteristic in the direction orthogonal to the rolling direction, (3) has excellent bendability, or (4) has excellent press punchability.

Description

technical field [0001] The present invention relates to a copper alloy sheet, and more particularly, to a copper alloy sheet having properties suitable for connection parts such as terminals and connectors for automobiles. Background technique [0002] Connecting parts such as terminals and connectors for automobiles in recent years are required to have performance that can ensure reliability in high-temperature environments such as engine compartments. One of the most important characteristics for the reliability in this high-temperature environment is the maintenance characteristic of the contact fitting force, so-called stress relaxation resistance characteristic. [0003] exist Figure 4 In , the structure of a typical box-shaped connector (female terminal 3 ) is shown as a connecting member such as an automotive terminal / connector. Figure 4 (a) represents a front view, Figure 4 (b) shows a cross-sectional view. in the Figure 4 Among them, the female terminal 3 is su...

AI Technical Summary

Problems solved by technology

[0019] Therefore, even according to Japanese Patent No. 3871064 and Japanese Patent Application Laid-Open No. 2002-294368, as mentioned above, in the existing Cu-Ni-Sn-P alloy, if the 0.2% yield strength is about 500 MPa, If the elongation is lower than 10%, the elongation is not high in proportion to the strength, and even if the stress relaxation rate is below 15%, the electrical conductivity is not high

Images