Plastic compound, application thereof and method of selective metallization of plastic surface

A plastic composition and plastic technology, applied in metal material coating process, liquid chemical plating, coating, etc., can solve the problem of no selectivity in the generation of patterns, and achieve the effect of easy control and widening the range

Active Publication Date: 2010-06-23
BYD CO LTD
View PDF4 Cites 87 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The maximum speed of UV movement is 100mm/s, an

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Plastic compound, application thereof and method of selective metallization of plastic surface
  • Plastic compound, application thereof and method of selective metallization of plastic surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] This example is used to illustrate the plastic composition of the present invention and the method for selective metallization of plastic surfaces.

[0041] 100g of Ni with an average particle diameter of 50 nm 2 o 3And the talc powder of 10g joins in the polycarbonate of 1000g, mixes at a high speed, obtains the plastic composition of the present invention, then it is transferred to extruder and extruded granulation, and then it is transferred to injection molding machine Plastic samples were injection molded to a thickness of 2 mm. Place the plastic sample on the laser sample stage, focus the laser, and the computer program controls the movement of the beam or sample stage. The laser used is Han’s YLP-20 laser, and the laser parameters are: wavelength 1064nm, scanning speed 1000mm / s, step size 9μm , delay 30μs, frequency 40KHz, power 3W, filling pitch 50μm. After laser etching, the plastic samples were decontaminated and then placed in CuSO 4 ·5H 2 O: 0.12mol / L, ...

Embodiment 2

[0043] This example is used to illustrate the plastic composition of the present invention and the method for selective metallization of plastic surfaces.

[0044] 100 g of Co with an average particle diameter of 100 nm 2 o 3 And the glass fiber of 30g joins in the PC of 5000g, mixes evenly at a high speed, obtains the plastics composition of the present invention, then it is transferred to the extruder to extrude granulation, then it is transferred to the injection molding machine and injected into 2 mm thick plastic samples. Place the plastic sample on the laser sample stage, focus the laser, and the computer program controls the movement of the beam or sample stage. The laser used is Han’s YLP-20 laser, and the laser parameters are: wavelength 300nm, scanning speed 5000mm / s, step size 3μm , delay 60μs, frequency 40KHz, power 3W, filling pitch 30μm. After laser etching, the plastic samples were decontaminated and then placed in CuSO 4 ·5H 2 O: 0.12mol / L, Na 2 EDTA·2H ...

Embodiment 3

[0046] This example is used to illustrate the plastic composition of the present invention and the method for selective metallization of plastic surfaces.

[0047] 100 g of CuSiO with an average particle diameter of 500 nm 3 And the kaolin of 70g joins in the 10000g polyethylene terephthalate, mixes at a high speed, obtains the plastic composition of the present invention, then it is transferred to extruder granulation in the extruder, then it is transferred to Plastic samples with a thickness of 2 mm were injection molded in an injection molding machine. Place the plastic sample on the laser sample stage, focus the laser, and the computer program controls the movement of the beam or sample stage. The laser used is Han’s YLP-20 laser, and the laser parameters are: wavelength 10600nm, scanning speed 8000mm / s, step size 6μm , delay 100μs, frequency 30KHz, power 4W, filling pitch 40μm. After laser etching, the plastic samples were decontaminated and then placed in CuSO 4 ·5H ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a plastic compound, which comprises a plastic substrate component and a catalyst component, wherein the catalyst component is selected from one kind or two or more kinds of oxides of the metal elements in the ninth line, the tenth line and the eleventh line of the periodic table of elements except copper, silicates, borates and oxalates of the metal elements in the ninth line, the tenth line and the eleventh line of the periodic table of elements, hydrogenation catalysts with the metal elements in the ninth line, the tenth line and the eleventh line of the periodic table of elements and ABO2 type compound oxides with a delafossite structure; A is selected from one kind of the metal elements in the ninth line, the tenth line and the eleventh line of the periodic table of elements, B is Ni, Mn, Cr, Al or Fe, and A and B are different from each other. The invention also relates to application of the plastic compound in the selective metallization of a plastic surface. Moreover, the invention provides a method of the selective metallization of the plastic surface. When the method is applied, the circuit can be further easily formed.

Description

technical field [0001] The invention relates to a plastic composition and its application in selective metallization of plastic surfaces and a method for selective metallization of plastic surfaces. Background technique [0002] The technology of directly forming a three-dimensional circuit on the surface of an injection molded part can realize the electrical interconnection function of an ordinary circuit board, the function of supporting components, and the support and protection of plastic parts on one device, forming a three-dimensional, electromechanical function. Integrated circuit carrier. This kind of technology can design and select a suitable shape according to the needs, realize multi-function, reduce the installation level, and reduce the number of components. It has been applied in the fields of automobile, industry, computer, communication and so on. [0003] Selective metallization of plastic surfaces is an important part of three-dimensional circuit technolo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C08L101/00C08L69/00C08L67/02B29C45/00C23C18/38C23C18/32
Inventor 宫清周良苗伟峰张雄
Owner BYD CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap