Tectorial membrane sand solidifying system suitable for low-temperature reservoir sand prevention

A technology of coated sand and low-temperature oil, which is applied in drilling compositions, chemical instruments and methods, etc., can solve the problems of non-curing and low consolidation strength of the consolidated body.

Inactive Publication Date: 2010-06-23
CHINA UNIV OF PETROLEUM (EAST CHINA)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a low-temperature coated sand curing system that can form a consolidated body with higher compressive strength under low-temperature oil reservoir conditions, so as to overcome the current common resin-coated sand curing system under low temperature or water environment. The formed consolidated body has low or uncured consolidation strength and other disadvantages

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] 1. Preparation of cement for low-temperature coated sand

[0024] The invention utilizes the synergistic effect between the resins to compound the epoxy resin and the phenolic resin to obtain a cement that can be used as a low-temperature coated sand. Choose liquid epoxy resin E-44 with an epoxy value of 0.42-0.47eq / 100g and an epoxy equivalent of 215-240g / eg, and a liquid epoxy resin with an epoxy value of 0.24-0.27eq / 100g and an epoxy equivalent of 370-410g / eg The solid epoxy resin AL-200 and the liquid phenolic resin PFn-5300 are mixed according to the weight percentage of 40% E-44, 56% AL-200 and 4% PFn-5300, heated to 90 ° C and stirred evenly, that is A composite phenolic-epoxy resin for preparing low-temperature coated sand is obtained.

[0025] 2. Preparation of low-temperature coated sand

[0026] The low-temperature coated sand is composed of quartz sand, composite phenolic-epoxy resin, silane coupling agent KH560 and sulfamic acid. The weight ratio of the ...

Embodiment 2

[0032] 1. Preparation of cement for low-temperature coated sand

[0033] Choose liquid epoxy resin E-44 with an epoxy value of 0.42-0.47eq / 100g and an epoxy equivalent of 215-240g / eg, and a liquid epoxy resin with an epoxy value of 0.24-0.27eq / 100g and an epoxy equivalent of 370-410g / eg The solid epoxy resin AL-200 and the liquid phenolic resin PFn-5300 are mixed according to the weight percentage of 45% E-44, 53% AL-200 and 2% PFn-5300, heated to 90 ° C and stirred evenly, that is A composite phenolic-epoxy resin for preparing low-temperature coated sand is obtained.

[0034] 2. Preparation of low-temperature coated sand

[0035] The weight ratio of the low-temperature coated sand with a cement content of 10% is quartz sand: composite phenolic-epoxy resin: silane coupling agent KH560: sulfamic acid=100:10:0.02:0.06. Among them, the particle size of the quartz sand is 0.4-0.8mm, and it is prepared according to the conventional coated sand preparation method to obtain low-tem...

Embodiment 3

[0041] 1. Preparation of cement for low-temperature coated sand

[0042] Choose liquid epoxy resin E-44 with an epoxy value of 0.42-0.47eq / 100g and an epoxy equivalent of 215-240g / eg, and a liquid epoxy resin with an epoxy value of 0.24-0.27eq / 100g and an epoxy equivalent of 370-410g / eg The solid epoxy resin AL-200 and the liquid phenolic resin PFn-5300 are mixed according to the weight percentage of 50% E-44, 46% AL-200 and 4% PFn-5300, heated to 90 ° C and stirred evenly, that is A composite phenolic-epoxy resin for preparing low-temperature coated sand is obtained.

[0043] 2. Preparation of low-temperature coated sand

[0044]The weight ratio of the low-temperature coated sand with a binder content of 12% is quartz sand: composite phenolic-epoxy resin: silane coupling agent KH560: sulfamic acid=100:12:0.03:0.09. Among them, the particle size of the quartz sand is 0.4-0.8mm, and it is prepared according to the conventional coated sand preparation method to obtain low-temp...

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Abstract

The present invention provides a tectorial membrane sand solidifying system suitable for low-temperature reservoir sand prevention, which is a solidifying system with high reactive activity under water environment and low-temperature condition formed by mixing low-temperature tectorial membrane sand using complex novolac epoxy as plasteringagent and a water-soluble firming agent. Wherein liquid phenolic resin, liquid novolac epoxy and solid novolac epoxy are mixed according to a certain proportion, and then, are stirred evenly when temperature is raised to the softening point of the solid novolac epoxy to prepare the complex novolac epoxy; then, the complex novolac epoxy is used as the plasteringagent, and quartz sand, resin acceptor, intensifier and the like as raw material to prepare the low-temperature tectorial membrane sand is prepared by coating. The water-soluble firming agent is formed by mixing triethylene tetramine, quadrol, phenol, formaldehyde, acetone and the like. Under the function of the water-soluble firming agent, the low-temperature tectorial membrane sand can be solidified during the temperature range of 30 DEG C to 50 DEG C; the pressive strength and the permeability of the formed induration are high; the present invention has the strong abilities of temperature resistance, aging resistance and scour resistance; and the present invention can satisfy the needs of low-temperature reservoir sand prevention.

Description

technical field [0001] The invention relates to an oilfield chemical agent, in particular to a cementing agent and a curing agent used in a low-temperature coated sand curing system. Background technique [0002] The artificial borehole wall sand control method is commonly used in oil fields to prevent sand production in oil and water wells, and the artificial borehole wall method with coated sand is a chemical sand control method with better effect at present. The preparation of coated sand requires a cement, and the cement that can be used includes phenolic resin, furan resin, polyurethane resin, epoxy resin, etc. Among them, the curing temperature of phenolic resin, furan resin and polyurethane resin is relatively high, generally higher than 60°C, and the curing strength at low temperature is very low, or even not cured. Although epoxy resin can be cured under low temperature conditions, it must use an organic solvent as a dispersion medium, and the curing strength is ve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K8/575
Inventor 刘德新范明福汪小平罗耀珑
Owner CHINA UNIV OF PETROLEUM (EAST CHINA)
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