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Solar cell module and method for producing the same

A technology of solar cells and manufacturing methods, applied to circuits, electrical components, photovoltaic power generation, etc., can solve problems such as deformation of bonding wires 211, and achieve the effect of preventing wire offset

Inactive Publication Date: 2010-06-23
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Here, in the above-mentioned technique using the EVA sheet 214, when the EVA sheet 214 is placed on the bonding wire 211 and the solar cell element 212, a load accompanying the self-weight of the EVA sheet 214 to the bonding wire 211 occurs, Due to this load, there is a problem that there is a fear of deformation of the bonding wire 211 (see Figure 11 )

Method used

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  • Solar cell module and method for producing the same
  • Solar cell module and method for producing the same
  • Solar cell module and method for producing the same

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Embodiment Construction

[0048] figure 1 It is a cross-sectional view showing the structure of a solar cell module according to one embodiment of the present invention.

[0049] figure 1 The shown solar cell module 100 has a structure including bonding wires (leads) 1 , solar cell elements 2 , substrate 3 , and filling resin (high-viscosity resin) 5 .

[0050] The bonding wire 1 is a metal wire for connecting the solar cell element 2 to the substrate 3 by a known wire bonding method. In the bonding wire 1 , one end is connected to the solar cell element 2 via the surface electrode 21 , and the other end is connected to a not-shown electrode of the substrate 3 . Thus, the solar cell element 2 is mounted on the substrate 3 via the bonding wire 1 , and the solar cell element 2 and the substrate 3 are electrically connected via the bonding wire 1 . Examples of materials constituting the bonding wire 1 include gold, copper, and aluminum.

[0051] The solar cell element 2 is an element that, when ligh...

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Abstract

An object of the present invention is to provide a solar cell module in which a solar cell element connected with a substrate by wire bonding is sealed and which is capable of preventing deformation of a bonding wire. For this object, the solar cell module of the present invention is designed such that the bonding wire is sealed with potting resin so that a surface of the solar cell element, which surface is opposite to the substrate, is exposed.

Description

technical field [0001] The present invention relates to a solar cell module manufactured by sealing a solar cell element connected (mounted) to a substrate by wire bonding and a method for manufacturing the same. Background technique [0002] Conventionally, as a technique for sealing a solar cell element connected (mounted) to a substrate by wire bonding, a technique of covering the solar cell with an epoxy resin using a mold and sealing it is known. [0003] However, the above-mentioned technique using a mold is difficult to implement at low cost because of the need for the mold, and is not suitable for mass production because it cannot seal a plurality of solar cell elements in batches. In addition, in the above technique using a mold, after injecting epoxy resin into the mold, the epoxy resin is taken out from the mold by utilizing the curing shrinkage of the epoxy resin at the time of molding, but after this taking out, the completed solar cell Module bending problem. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/048H01L31/18
CPCY02E10/50H01L31/048H01L2224/48465H01L2224/8592
Inventor 石原诚治中西宏之
Owner SHARP KK