Unlock instant, AI-driven research and patent intelligence for your innovation.

Radiating device

A heat dissipation device and heat pipe technology, applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating transformation, etc., can solve the problems of limiting heat dissipation efficiency of heat dissipation devices, and achieve the effect of improving heat dissipation efficiency

Inactive Publication Date: 2010-06-23
FU ZHUN PRECISION IND SHENZHEN +1
View PDF0 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The fins are rectangular and parallel to each other, so that the height of the airflow channel between the fins is also at a certain value, so the airflow generated by the fan passes through the fins at a constant speed, and even the speed of the airflow is reduced due to the resistance on the surface of the fins. reduced, thereby limiting the cooling efficiency of the heat sink

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Radiating device
  • Radiating device
  • Radiating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] Such as figure 1 and figure 2 As shown, the heat dissipation device of an embodiment of the present invention includes a substrate 10, a first fin group 20 and a second fin group 30 placed on the substrate 10, and the substrate 10 is connected to the first and second fin groups. 20, 30 of the first heat pipe 40, the second heat pipe 50 and a fan 60 placed at one end of the first and second fin sets 20, 30.

[0012] The substrate 10 is a substantially rectangular board. The substrate 10 is made of materials with high thermal conductivity, such as copper, aluminum, and the like. Two parallel grooves 12 are formed on the top surface of the substrate 10 . The bottom surface of the substrate 10 is used for attaching a heat-generating electronic component 100 such as a CPU. The electronic component 100 is mounted on a circuit board (not shown). A through hole 14 is respectively formed in four corners of the substrate 10 .

[0013] The heat dissipation device also inclu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a radiating device comprising a base plate, a fin set arranged on the base plate, a hot pipe connected with the base plate and the fin set and a fan arranged on one end of the fin set, wherein the fin set comprises a plurality of fins mutually in parallel; flow ways for air to flow are formed among the fins; each fin comprises an air inlet section nearby the fan, an air outlet section nearby the fan and a tapered section for connecting the air inlet section and the air outlet section; and air flow generated by the fan is speeded up at the tapered section, and flows out of the air outlet section. Because the tapered section is arranged in the fin set, the air flow generated by the fan is speeded up to flow out of the fin set, and thus, the total radiating efficiency of the radiating device is improved.

Description

technical field [0001] The invention relates to a cooling device, in particular to a cooling device for cooling electronic components. Background technique [0002] High-power electronic components such as computer central processing unit, north bridge chip, graphics card, etc. will generate a lot of heat during operation. If the heat cannot be effectively dissipated, it will directly lead to a sharp rise in the temperature of electronic components, which will seriously affect the performance of electronic components. normal operation. For this reason, a heat sink is needed to dissipate heat from these electronic components. [0003] A traditional heat dissipation device includes a base plate in contact with electronic components, several fins arranged on the base plate and a fan. The forced airflow generated by the fan enhances the cooling effect of the fins. The fins are rectangular and parallel to each other, so that the height of the airflow channel between the fins i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20H01L23/367H01L23/467
CPCH01L23/467H01L23/4006F28D15/0275H01L23/3672H01L23/427H01L2924/0002H01L2924/00
Inventor 廉志晟邓根平陈俊吉
Owner FU ZHUN PRECISION IND SHENZHEN