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Electric circuit configuration and method for producing electric circuit configuration

A technology of circuit devices and electronic circuits, which is applied in the direction of assembling printed circuits, circuits, printed circuits, etc.

Inactive Publication Date: 2013-11-27
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The conventional assembly method requires additional space for wiring to complete the electrical connection of the first and second circuit devices

Method used

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  • Electric circuit configuration and method for producing electric circuit configuration
  • Electric circuit configuration and method for producing electric circuit configuration
  • Electric circuit configuration and method for producing electric circuit configuration

Examples

Experimental program
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Effect test

Embodiment approach

[0042] There are the following implementations: conductive boards / printed circuit boards 5, 12, 17 all component group carriers, e.g. STD-substrates, low temperature co-fired ceramics (LTCC), DCB-substrates (DCB: direct copper deposition), conventional conductive boards .

[0043] In addition, there are the following advantages:

[0044] - Avoid space-wasting connection elements such as plugs, wires, lead frames, bonding, elastic conductive plates.

[0045] - Uniform soldering and conductive glue assembly, especially for interconnecting a control electronics and a power electronics 25, 26.

[0046] In this case, the solder connection 29 is used for the high-current area or the power electronics 26 , and the electrically conductive adhesive connection 32 is used for the low-current area or the control electronics 25 .

[0047] The unification of welding and adhesive assembly techniques is achieved through the use of said transfer device 2 . The tasks of the transfer device 2...

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PUM

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Abstract

An electrical circuit system includes at least one first circuit device and at least one second circuit device, the two circuit devices being electrically connected to one another by interconnecting at least one transfer device. The transfer device is electrically connected to the first circuit device by conductive adhesive bonds, and the transfer device is electrically connected to the second circuit device by conductive adhesive bonds and / or solder joints. Furthermore, a method for producing a corresponding electrical circuit system.

Description

technical field [0001] The invention relates to an electronic circuit arrangement comprising at least one first circuit arrangement and at least one second circuit arrangement, wherein the circuit arrangements are electrically connected to one another via at least one intermediate connection of transfer means. [0002] Furthermore, the invention relates to a method for producing an electronic circuit arrangement comprising at least one first circuit arrangement and at least one second circuit arrangement, between which at least one A transfer device, and the circuit device is electrically connected to the transfer device. Background technique [0003] Such circuit arrangements comprising two circuit arrangements are known, for example electronic devices of different functions. The electronics generally consist of a first circuit arrangement as control electronics and a second circuit arrangement as power electronics. The control electronics and the power electronics are in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/36
CPCH05K1/144H05K3/3436H01L2224/73267H05K3/321H05K1/0306H01L2224/48227H05K2201/049H05K2201/10378H01L24/19H01L2924/19106H01L2924/1531H01L2224/73265H01L2224/32225H01L2924/19105H01L24/73Y10T29/49117H01L2924/00012
Inventor M·弗朗茨
Owner ROBERT BOSCH GMBH