Integrated circuit chip encapsulation assembly

Abstract

The invention relates to an integrated circuit chip encapsulation assembly which comprises a carrier plate, an integrated circuit chip, a plurality of lead wires, a plurality of pins, a sealing compound and a heat conductor, wherein the integrated circuit chip is positioned above the carrier plate, the integrated circuit chip are connected with the pins by the lead wires, the carrier plate, the integrated circuit chip and the lead wires are all arranged in the sealing compound, the pins are protruded from the outside of the sealing compound, and the heat conductor is positioned above the integrated circuit chip and is protruded from the sealing compound. The integrated circuit chip encapsulation assembly can effectively radiate the heat of the integrated circuit chip.

Description

technical field [0001] The invention relates to an integrated circuit chip package assembly. Background technique [0002] With the advancement of integrated circuit technology, the integration level of the internal circuits of integrated circuit chips has been greatly improved. When the integrated circuit chip operates at high speed, its internal circuit will generate a large amount of heat energy, which will cause the temperature of the integrated circuit chip to rise gradually. Therefore, the heat dissipation problem of the integrated circuit is more and more concerned by designers. [0003] In order to quickly remove the heat generated by the integrated circuit chip when it works at high speed, so that the chip can still maintain normal operation for a long time when it works at high speed, the prior art generally uses the metal pins at the bottom of the integrated circuit chip package A large amount of heat energy generated is transmitted to the printed circuit board c...

AI Technical Summary

Problems solved by technology

If the heat energy produced by the integrated circuit chip is large, the above method is not easy to dissipate the heat energy quickly due to the small heat dissipation area of ​​the metal pin and the limitation of the heat dissipation performance of the sealant, thereby affecting the working performance and performance of the integrated circuit chip. possible damage to integrated circuit chips

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