Dustproof method for electronic device and electronic device
An electronic device and dust-proof technology, which is applied in the direction of electromechanical devices, electrical components, electric components, etc., can solve the problems of reducing dust and not being able to provide the efficiency of air intake and heat dissipation
Inactive Publication Date: 2012-02-08
WISTRON CORP
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Problems solved by technology
[0003] Many factors of poor heat dissipation are caused by the accumulation of dust on the fan blades of the heat dissipation module, or on the heat dissipation fins of the heat dissipation module. In order to improve the problem of dust accumulation, there is a way not to directly install the vent The fan of the cooling module is directly under the fan, but the vents in other positions of the notebook computer casing are used to take in the air. Although this method can reduce the speed of dust accumulation, the temperature will increase with the increase of the workload of the central processing unit. If the air intake area formed by the vent is fixed, it cannot provide more air intake to improve the efficiency of heat dissipation. Therefore, how to conceive a problem that can effectively reduce the accumulation of dust and The design that can increase the air intake in time with the increase of the working temperature of the central processing unit becomes the subject of further improvement in the present invention.
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[0049] The aforementioned and other technical content, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. Through the description of the specific implementation, it should be possible to gain a more in-depth and specific understanding of the technical means and effects of the present invention to achieve the intended purpose. However, the attached drawings are only for reference and description, and are not used to limit the present invention. .
[0050] Before the present invention is described in detail, it should be noted that in the following description, similar components are denoted by the same numerals.
[0051] Such as figure 1and figure 2 As shown, it is a preferred embodiment of the dust-proof method of the electronic device of the present invention. The electronic device 100 includes a housing 1, a main board 2, a heating component 3,...
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The invention relates to a dustproof method for an electronic device and the electronic device. Specifically, a dust-proof method for an electronic device is applicable to a casing provided with a heating component and a dust-proof mechanism, the casing includes a vent, and the dust-proof mechanism includes a cover plate for covering or opening the vent , the dustproof method comprises the following steps: when detecting that the temperature of the heating component rises to a first preset temperature, driving the cover plate to move to open the vent; detecting that the temperature of the heating component drops to a second preset temperature lower than the first preset temperature When the temperature is set, the cover plate is driven to move to cover the air vent; thereby, the electronic device can effectively reduce the accumulation of dust and increase the efficiency of heat dissipation.
Description
technical field [0001] The invention relates to a dustproof method of an electronic device and the electronic device, in particular to a dustproof method of an electronic device which controls the opening or closing of a vent through the temperature change of a heating component and the electronic device. Background technique [0002] At present, the volume of notebook computers tends to be thinner and lighter in design. Therefore, how to make the heat dissipation module maintain a good heat dissipation efficiency for the central processing unit (CPU) is a very important issue under the limited space constraints. [0003] Many factors of poor heat dissipation are caused by the accumulation of dust on the fan blades of the heat dissipation module, or on the heat dissipation fins of the heat dissipation module. In order to improve the problem of dust accumulation, there is a way not to directly install the vent The fan of the cooling module is directly under the fan, but the v...
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IPC IPC(8): G06F1/20G06F1/16H05K7/20H02K7/10
Inventor 黄家峰
Owner WISTRON CORP