Unlock instant, AI-driven research and patent intelligence for your innovation.

Laminated mounting structure and method for manufacturing laminated mounting structure

A manufacturing method and structure technology, which can be used in semiconductor/solid-state device manufacturing, printed circuit manufacturing, structural connection of printed circuits, etc. Ensuring the height and realizing the effect of narrowing the pitch

Active Publication Date: 2012-05-23
OLYMPUS CORP
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, (1) it is premised that the laminated electronic circuit boards are detachable from each other; (2) in the case of forming a plurality of connection parts, it is difficult to align and assemble to the recess; (3) it does not take into account the multiple Electronic circuit substrates are laminated; (4) Since at least two components, the core and the elastic body, are required, miniaturization is difficult
[0006] Moreover, in the above-mentioned other conventional examples, the electronic components that can be embedded in the thickness of the substrate are limited to components whose height is smaller than the thickness of the substrate, and the wiring layers on the front and back of the main body of the substrate must be connected via the electronic components. big constraints
When the wiring layers on the front and back of the substrate body are not connected through electronic components, they can be connected through through holes. However, it is necessary to provide electrode pads (soldering electrodes) larger than the diameter of the through holes, and it is difficult to narrow the pitch of the substrate connection part. , so there is a limit to reducing the area of ​​the main surface of the substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laminated mounting structure and method for manufacturing laminated mounting structure
  • Laminated mounting structure and method for manufacturing laminated mounting structure
  • Laminated mounting structure and method for manufacturing laminated mounting structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] figure 1 It is a perspective view showing the structure of the first embodiment of the multilayer mounting structure according to the present invention separated into a first substrate 20 and a second substrate 30 . figure 2 It is a cross-sectional view showing the structure of the multilayer mounting structure 10 according to the first embodiment.

[0041] Such as figure 1 As shown, electronic components 26 are mounted on the main surface 20 a of the first substrate 20 . Furthermore, electronic components 36 are mounted on the second substrate 30 . The first substrate 20 and the second substrate 30 are arranged to face each other. For the first substrate 20 and the second substrate 30, a multilayer substrate or a substrate with built-in electronic components can be used.

[0042]The electrodes 22 are provided between the electronic components 26 of the first substrate 20 , and the substantially cylindrical conductive member 21 is provided on the electrodes 22 . A...

Embodiment 2

[0049] image 3 It is a perspective view showing the structure of the second embodiment of the multilayer mounting structure according to the present invention separated into a first substrate 50 and a second substrate 60 . Figure 4 It is an enlarged perspective view showing the relationship between the conductive member and the reinforcing member according to the second embodiment.

[0050] In the second embodiment, the difference from the first embodiment is that the reinforcing member 57 is formed around the conductive member 51 with a part or the whole of the mounting area exposed. That is, the first substrate 20, the conductive member 21, the electrode 22, the electronic component 26, the second substrate 30, and the electronic component 36 in the multilayer mounting structure 10 of the first embodiment correspond to the multilayer mounting structure of the second embodiment. 40, the first substrate 50, the conductive member 51, the electrode 52, the electronic componen...

Embodiment 3

[0054] Figure 5 It is a perspective view showing the structure of Example 3 of the laminated mounting structure according to the present invention.

[0055] In the stacked mounting structure 70 of the third embodiment, like the insulating layer 23 of the first embodiment, an insulating material made of resin is formed around the electronic components (not shown) and the conductive member 81 on the first substrate 80 . The insulating layer 83 is formed, and the wiring 88 is formed on the surface of the insulating layer 83 away from the first substrate 80 so as to be connected to the conductive member 81 . That is, in Example 3, the wiring 88 is directly formed on the insulating layer 83 without placing a second substrate like the second substrate 30 of the Example 1 and the second substrate 60 of the Example 2. In addition, as a method for forming the wiring 88, a printed wiring using plating, sputtering, vapor deposition, or inkjet or dispersion can be used. By adopting suc...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Provided is a laminated mounting structure wherein a narrow pitch is achieved and a height for mounting a component to be mounted is ensured. A method for manufacturing such laminated mounting structure is also provided. In the laminated mounting structure, at least one main surface is provided with a plurality of members each of which has a mounting region required for arranging and operating the component to be mounted and a connecting region for transmitting a signal for operating the component; and conductive members arranged in the connecting region between the facing members. The cross-section of the conductive member is the same as that of the connecting region or smaller, an end section of the conductive member reaches from the main surface of the one member to the main surface ofthe other member, and the height of the conductive member specifies an interval between the mounting regions.

Description

technical field [0001] The present invention relates to a stacked mounting structure and a method for manufacturing the stacked mounting structure. Background technique [0002] Conventionally, as an inter-substrate connection member for connecting laminated electronic circuit boards, there is an inter-substrate connection member described in Patent Document 1 (Japanese Unexamined Patent Application Publication No. 2001-144399). In this board-to-board connection member, an elastic body is used to cover a core made of a rigid conductor, and the periphery of the elastic body is covered with a conductive material. By configuring the board-to-board connection member in this way, there is an effect that the electronic circuit board does not need to be heated for separation during repair work. [0003] In addition, as another conventional example, the following conventional example has been proposed. In order to realize a small-sized and high-density substrate with built-in elect...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/065H01L25/07H01L25/18H05K1/14
CPCH01L2225/1058H05K2201/10318H05K2203/025H05K3/30H05K3/284H05K3/3436H01L23/3121H01L2225/1035H01L25/105H01L21/56H05K2201/042H01L2225/1023H05K2203/1316H05K1/144H05K2201/10242H05K3/368H01L24/19H01L25/0657H01L2224/04105H01L2224/12105H01L2224/274H01L2225/0652H01L2225/06541H01L2924/0002H01L2924/01079H05K3/3426H05K3/4046H05K3/4647Y10T29/49117Y10T29/4913Y10T29/49147H01L2924/00
Inventor 中村干夫近藤雄
Owner OLYMPUS CORP