Input device and method of manufacturing the same

Abstract

The invention aims to provided an input device which can inhibit increase of wiring resistance compared with the prior art. The input device has a transparent base material (2), a first wiring layer (8) stretching from each transparent electrode (3) to a decoration region (25) at a side of a display region, an insulation layer (20) having a contact hole (20a) at a position opposite to the surface of the first wiring layer (8) and formed a surface side of the transparent base material, a conductive part (21) formed in the contact hole (20a), a second wiring layer (15a) integrated with the conductive part (21) and stretching to form the surface of the insulation layer (20). The width size of the contact hole (20a) is gradually increasing from a surface side of the first wiring layer to a surface side of the insulation layer, and a side wall surface (20c) of the contact hole (20a) forms an inclined surface. In addition, the conductive part (21) is filled in the contact hole.

Description

technical field [0001] The present invention relates to an input device capable of detecting the operation position of an operation surface, and in particular to a structure of a wiring layer arranged in a decoration area. Background technique [0002] In a capacitive input device (touch panel), a plurality of transparent electrodes are arranged in a display area of ​​a transparent substrate, and each first wiring layer drawn from each transparent electrode extends to a decoration area around the display area. . [0003] In Patent Document 1 figure 1 C. figure 2 B. In FIG. 5, a second wiring layer different from the first wiring layer is provided, and the first wiring layer and the second wiring layer are electrically connected through a contact hole formed in an insulating layer between them. . [0004] 【Prior technical literature】 [0005] 【Patent Literature】 [0006] [Patent Document 1]: Japanese Unexamined Patent Publication No. 2010-541109 [0007] 【Summary of I...

AI Technical Summary

Problems solved by technology

[0010] However, when the wiring width is reduced, there is a problem that the wiring resistance becomes high and the detection responsiveness decreases.

In Patent Document 1, at the position of the contact hole, a wiring pattern with a substantially constant thickness is formed following the sidewall of the contact hole, but it does not have a structure capable of suppressing an increase in wiring resistance.

In addition, a thinner wiring pattern has lower adhesion and lower electrical connection reliability

[0011] In addition, when an insulating layer having a contact hole is formed by screen printing, the film thickness becomes relatively thick, and since the depth of the contact hole is deep, there is a possibility that the electrical connection between the upper and lower wiring layers cannot be properly connected through the contact hole. connection problem

Furthermore, in a structure in which the wiring layer is formed by Ag screen printing or the like as in the prior art, there is also a problem that the wiring layer cannot be formed at a narrow pitch.

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