Hot wire fixing structures for transient hot wire method measurement

A technology of fixed structure and hot wire method, which is applied in the direction of material thermal conductivity, etc., can solve the problems of uncommercialization and easy breakage of hot wire, and achieve the effect of not being afraid of vibration and shaking, easy welding of hot wire, and stable structure of hot wire fixing

Inactive Publication Date: 2010-08-18
XIAN XIATECH ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] Several hot wire fixing structures proposed by the present invention are very stable and firm, and fundamentally solve the problem that the hot wire is easily broken and cannot be commercialized

Method used

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  • Hot wire fixing structures for transient hot wire method measurement
  • Hot wire fixing structures for transient hot wire method measurement
  • Hot wire fixing structures for transient hot wire method measurement

Examples

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Embodiment Construction

[0025] The invention successfully overcomes two factors affecting the reliability of the hot wire structure.

[0026] (1) Use a metal wire or metal rod made of the same material as the hot wire (or very close to the linear expansion coefficient) as the bracket, straighten the hot wire and weld it to the bracket with a certain tension, which can ensure that the hot wire remains tensioned at any temperature state. This method does not need to hang heavy objects or add springs, which greatly enhances the reliability of the hot wire.

[0027] (2) Weld the hot wire directly on the wire support, so that only 2 solder points are needed for a single hot wire, and only 3 solder points are needed for a double hot wire, and the welding is also very easy. In the structure of the present invention, only 6 wires need to be drawn out from the dual heating wires, which simplifies the structure of the dual heating wires.

[0028] Figure 1~2 It is three kinds of hot wire fixing structure di...

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Abstract

The invention discloses hot wire (hot wire source) fixing structures for a thermal conductivity measurement device by a transient hot wire method and an application example for the measurement device, which are characterized in that: the reliable and stable hot wire fixing structures are realized, and the thermal conductivity measurement of fluid at different temperatures and under different pressures can be realized by combining the exampled application example. Experiments prove that the hot wire fixing structures are very firm and the measurement accuracy is high.

Description

technical field [0001] The invention relates to the technical field of fluid thermophysical property testing, in particular to the field of experimental measurement of fluid thermal conductivity, in particular to several fixed structures of hot wires (wire heat sources) used for transient hot wire method measurement. Background technique [0002] As an important physical parameter of matter, thermal conductivity has important uses in the fields of petroleum, chemical industry, materials, energy, biology, pharmaceuticals, power and refrigeration engineering, and is an essential basic data in many industrial processes and product designs. With the rapid development of modern industry, the measurement of thermal conductivity of fluid materials has been paid more and more attention. The thermal conductivity of a substance can be obtained through experimental measurement, theoretical calculation or computer simulation, but at present it is still mainly based on experimental measu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/18
Inventor 张可薛征欣吴江涛
Owner XIAN XIATECH ELECTRONICS TECH
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