The invention discloses a quasi-
stable state method
thermal conductivity measurement apparatus, which includes a direct-current power supply, a
data acquisition processing system, two heating plates respectively connected to the direct-current power supply, four thermo-electric couples connected to the
data acquisition processing system, four identical samples, seven soaking
metal sheets and a measurement container stuffed with
thermal insulation material. The
thermal conductivity measurement apparatus is characterized in that the upper end of the measurement container is provided with a cover, screw threads are machined in the center of the cover and mounted with a bolt, the bolt presses a compressing
metal plate above the heat preserving cover, to decrease the inside
contact resistance. Two thin film heating plates with staggered structure are adopted, thereby heating on the samples are uniform. The soaking
metal plate is provided with grooves, and the corresponding thermo-electric couples are fixed in the grooves by
heat conducting glue, the soaking metal plate further uniforms the heat produced by the heating plate, and grooving on the sample is not needed during test, thereby the experimental investigation to different
solid thermal conductivities can be conveniently executed.