The invention discloses a quasi-stable state method thermal conductivity measurement apparatus, which includes a direct-current power supply, a data acquisition processing system, two heating plates respectively connected to the direct-current power supply, four thermo-electric couples connected to the data acquisition processing system, four identical samples, seven soaking metal sheets and a measurement container stuffed with thermal insulation material. The thermal conductivity measurement apparatus is characterized in that the upper end of the measurement container is provided with a cover, screw threads are machined in the center of the cover and mounted with a bolt, the bolt presses a compressing metal plate above the heat preserving cover, to decrease the inside contact resistance. Two thin film heating plates with staggered structure are adopted, thereby heating on the samples are uniform. The soaking metal plate is provided with grooves, and the corresponding thermo-electric couples are fixed in the grooves by heat conducting glue, the soaking metal plate further uniforms the heat produced by the heating plate, and grooving on the sample is not needed during test, thereby the experimental investigation to different solid thermal conductivities can be conveniently executed.