3 omega thermal conductivity measurement scheme suitable for metal film material

Abstract

The invention belongs to the technical field of microelectronics, and in particular discloses a 3 omega thermal conductivity measurement method suitable for a metal film material. In the method, a group of frequency-related heat flow ratios is obtained through an experimental fitting means by utilizing a 3 omega test structure and frequency-related thermal response characteristic based on an improved analytical model. The thermal resistance of an experimental material is deduced from the ratios, and a thermal conductivity value of a tested sample is finally obtained. The thermal conductivity measurement method of the invention can provide rapid and accurate thermal conductivity information of a metal film, so that the application range of 3 omega electrical measurement technology is greatly extended. The 3 omega thermal conductivity measurement method is suitable for measuring nanoscale films, has a simple sample structure, and avoids a complex process structure in the conventional electrical measurement method; therefore, the 3 omega thermal conductivity measurement method can be taken as a rapid characterization means for a thermal parameter of the metal film material, and has application prospect in the microelectronic industrial field.

Description

technical field [0001] The invention belongs to the technical field of microelectronics, and in particular relates to a 3omega thermal conductivity measurement method applicable to metal thin film materials whose film thickness is on the order of nanometers. Background technique [0002] At present, metallic nanostructured thin film materials with high thermal conductivity are widely used in many micro / nanoelectronic devices, optoelectronic devices, interconnect structures, and micromechanical systems. At the same time, with the continuous reduction of the feature size of integrated circuit systems, the thermal performance characterization technology of nanostructured materials has received more and more attention. The latest ITRS will establish a joint electrical-thermal-mechanical characteristic method as an integrated circuit performance modeling and simulation method. one of the most important challenges. Therefore, the establishment of thermal experimental characteriza...

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Problems solved by technology

Because the 3omega method needs to use the metal film as the heating and thermal element of the test structure, if the 3omega method is directly applied to the metal film thermal conductivity measurement, the thermal properties of the heating element and the measured material are close (both have high thermal conductivity) value of the metal thin film) and introduce a large measurement error, so the traditional 3omega measurement method cannot be directly applied to the metal thin

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