Measuring method for thermal conductivity of metal at high temperature

A measurement method and thermal conductivity technology, applied in the field of measurement, can solve the problems of easy oxidation of metals and low thermal conductivity accuracy, and achieve the effect of improving the accuracy and the measurement accuracy.

Active Publication Date: 2014-07-23
FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH
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  • Abstract
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Problems solved by technology

[0007] Based on this, it is necessary to provide a high-temperature thermal conductivity measurement method for metals to solve ...

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  • Measuring method for thermal conductivity of metal at high temperature
  • Measuring method for thermal conductivity of metal at high temperature
  • Measuring method for thermal conductivity of metal at high temperature

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Embodiment Construction

[0018] The following describes in detail various embodiments of the method for measuring the high-temperature thermal conductivity of metals of the present invention.

[0019] Such as figure 1 As shown, it is a schematic flow diagram of an embodiment of the method for measuring the high-temperature thermal conductivity of metals of the present invention, including:

[0020] Step S101: Obtain the thermal diffusivity of the metal sample at different temperatures, where the temperature is a temperature other than the oxidation temperature of the metal sample;

[0021] Wherein, the oxidation temperature refers to a temperature range, and this temperature range will cause the metal sample to be oxidized. The metal sample can be placed in the laser flash instrument, which can be heated to the desired temperature through the computer control system, and the atmosphere of the heating environment can be controlled as needed. After the temperature reaches the requirement, turn on the ...

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Abstract

The invention provides a measuring method for thermal conductivity of metal at high temperature. The measuring method comprises the following steps: acquiring thermal diffusion coefficients of a metal sample at different temperatures, wherein the temperatures refer to temperatures except the oxidizing temperature of the metal sample; acquiring thermal conductivity at a corresponding temperature according to the thermal diffusion coefficients and the density and specific heat capacity of the metal sample; acquiring a plurality of groups of initialization fitting regression equation of the temperatures and thermal conductivity according to each group of temperature and thermal conductivity data; subjecting each group of initialization fitting regression equation to test of goodness of fit according to the temperatures and thermal conductivity and establishing a fitting regression model of the temperatures and thermal conductivity; and determining thermal conductivity at different high temperatures according to the fitting regression model. With the method provided by the invention, thermal conductivity of metal at high temperature can be obtained, and accuracy of the obtained thermal conductivity is high.

Description

technical field [0001] The invention relates to the field of measurement technology, in particular to a method for measuring high-temperature thermal conductivity of metals. Background technique [0002] In traditional technology, reliability studies such as thermal performance and vibration characteristics of products are often evaluated through test measurements. With the development of computer technology, simulation technology is widely used in the reliability research of products in the thermal state, which can greatly reduce costs and improve efficiency. Therefore, it is very important to study the changes of physical properties of metal materials at high temperatures. Obtaining specific data of physical properties at high temperatures is the basis for accurate evaluation of thermal and mechanical reliability of products. Among them, thermal conductivity (also known as thermal conductivity) is an important parameter to characterize the thermal conductivity of material...

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Application Information

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IPC IPC(8): G01N25/20
Inventor 宋芳芳何小琦恩云飞黄彩然许沙
Owner FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH
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