Exposure method of printed wiring board

A technology for printed circuit boards and exposure methods, which is applied to photolithography exposure devices, microlithography exposure equipment, and chemical/electrolytic methods to remove conductive materials, etc., which can solve waste, high equipment configuration costs, and overall comprehensive effects. Long time and other problems, to achieve the effect of reducing equipment cost, reducing the number of purchases, and easy implementation

Inactive Publication Date: 2010-08-18
统将(惠阳)电子有限公司 +2
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the process of using an exposure machine to expose photosensitive materials is generally to perform one-time overall exposure on one board surface of the circuit board. Generally, the part of the original circuit with the thinnest line and the smallest distance between adjacent lines is used as the control of expos

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] Below is the part process that adopts the inventive method to make circuit board:

[0017] Bond the photosensitive material on the surface of the circuit board to be processed by hot pressing;

[0018] Then place the film with the original circuit pattern on the appropriate position on the circuit board that has pressed the photosensitive material;

[0019] According to the thickness of the lines in the photosensitive material or the spacing between adjacent lines, the photosensitive material on the circuit board is divided into high-resolution and low-resolution areas;

[0020] Use a 4CCD exposure machine to expose the photosensitive material in the high-resolution area, transfer the original circuit in the high-resolution area to the corresponding position of the photosensitive material on the circuit board; use a 2CCD exposure machine to expose the photosensitive material in the low-resolution area, and transfer the original circuit in the low-resolution area The or...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides an exposure method of a printed wiring board, which comprises the followings steps: a. dividing a photosensitive material into two or more than two regions according to the thickness of a line or the size of the space between adjacent lines on film used by the printed wiring board; and b. separately exposing the two or more than two regions divided in the step a by adopting exposure machines with different exposure resolutions. The method of the invention has concise step and easy implementation, and can effectively improve the exposure aging of the wiring board, reduce the purchase number of high-resolution exposure machines and reduce equipment cost.

Description

【Technical field】 [0001] The invention relates to a circuit board manufacturing technology, in particular to an exposure method for a printed circuit board with high efficiency and low cost. 【Background technique】 [0002] In the processing and manufacturing process of printed circuit board (PCB), image transfer is one of the most important processes. Its main function is to transfer the original circuit diagram to the circuit board that needs to be manufactured through the principle of photosensitive imaging. [0003] The image transfer mainly involves the following main steps: the first is the lamination process, which is to attach the photosensitive material to the surface of the circuit board to be processed by hot pressing; then there is the exposure process, which will have the original circuit pattern The film is placed on the circuit board on which the photosensitive material is pressed; then the exposure machine is used to expose the photosensitive material, and the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/06G03F7/20
Inventor 张飞龙
Owner 统将(惠阳)电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap