This invention relates to the field of magnetic particle
abrasive technology, specifically to a magnetic particle
abrasive device that combines
shot peening and
polishing functions. It primarily addresses the shortcomings of existing technologies, such as high equipment costs and low efficiency due to the inability to integrate
shot peening and
polishing functions, as well as the inapplicability of existing
shot peening and
polishing devices to long pipelines. The device includes a reciprocating
linear drive pair, a
magnetic field generating
assembly, and a planetary clamp. The
magnetic field generating
assembly includes a fixed ring and multiple electromagnets. The planetary clamp includes a support frame, a planetary carrier, a sun gear, planetary gears, an internal gear ring, a drive component, and a locking component. This device completes shot
peening or polishing through the movement of the pipeline relative to the magnetic particle structure, avoiding constraints such as
fluid pressure and space, making it suitable for
processing long pipelines. Simultaneously, this device combines shot
peening and polishing functions, eliminating the need for pipeline transfer between work sections and reducing the number of equipment required, thereby effectively reducing equipment costs and improving work efficiency.