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Polyimide film with improved thermal stability

A technology of polyimide film and film forming process, applied in transportation and packaging, synthetic resin layered products, chemical instruments and methods, etc. The effect of excellent thermal stability

Active Publication Date: 2010-09-08
KOLON IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in order to estimate the degree of change, several temperature changes must be performed, but the procedure is cumbersome
In addition, such polyimide films are difficult to use in fields requiring thermal dimensional stability

Method used

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  • Polyimide film with improved thermal stability
  • Polyimide film with improved thermal stability
  • Polyimide film with improved thermal stability

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] 599 grams of N,N-dimethylacetamide (DMAc) was placed in a one-liter reactor equipped with a stirrer, nitrogen inlet, dropping funnel, temperature controller, and condenser while passing nitrogen through the reactor , the temperature of the reactor was adjusted to 25°C, 64.046 g (0.2 mol) of bis-trifluoromethylbenzidine (TFDB) was dissolved therein, and then the solution was maintained at a temperature of 25°C. Further, 5.8544 g (0.02 mol) of biphenyltetracarboxylic dianhydride (BPDA) was added and the reaction solution was stirred for 1 hour, thereby completely dissolving the biphenyltetracarboxylic dianhydride (BPDA). During this time, the temperature of the solution was maintained at 25°C. Furthermore, 79.96 g (0.18 mol) of 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) was added, thereby obtaining a polyamide having a solid content of 20% by weight acid solution.

[0057] Thereafter, the polyamic acid solution was stirred at room temperature for 8...

Embodiment 2

[0061] As described in Example 1, 587.5 grams of N,N-dimethylacetamide (DMAc) was placed in the reactor, the temperature of the reactor was adjusted to 25° C., and 64.046 grams (0.2 mol) of bis- Trifluoromethylbenzidine (TFDB) was dissolved therein, after which the solution was maintained at a temperature of 25°C. Further, 11.768 g (0.04 mol) of biphenyltetracarboxylic dianhydride (BPDA) was added and the reaction solution was stirred for 1 hour, thereby completely dissolving the biphenyltetracarboxylic dianhydride (BPDA). The temperature of the solution was maintained at 25°C. Further, 71.08 g (0.16 mol) of 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) was added, whereby a polyamic acid solution having a solid content of 20 wt % was obtained.

[0062]Thereafter, the polyamic acid solution was stirred at room temperature for 8 hours, 31.64 g of pyridine and 40.91 g of acetic anhydride were added, stirred for 30 minutes, further stirred at 80° C. for 2 hours...

Embodiment 3

[0065] As described in Example 1, 575 grams of N,N-dimethylacetamide (DMAc) was placed in the reactor, the temperature of the reactor was adjusted to 25° C., and 64.046 grams (0.2 mol) of bis- Trifluoromethylbenzidine (TFDB) was dissolved therein, after which the solution was maintained at a temperature of 25°C. Further, 17.65 g (0.06 mol) of biphenyltetracarboxylic dianhydride (BPDA) was added and the reaction solution was stirred for 1 hour, thereby completely dissolving the biphenyltetracarboxylic dianhydride (BPDA). During this time, the temperature of the solution was maintained at 25°C. Further, 62.19 g (0.14 mol) of 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) was added, thereby obtaining a polyamic acid solution having a solid content of 20 wt%.

[0066] Thereafter, the polyamic acid solution was stirred at room temperature for 8 hours, 31.64 g of pyridine and 40.91 g of acetic anhydride were added, stirred for 30 minutes, further stirred at 80° C....

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Abstract

Disclosed is a polyimide film having superior thermal stability, in which the degree of change depending on variation in temperature is minimized.

Description

technical field [0001] The present invention relates to a polyimide film with improved thermal stability. Background technique [0002] Generally speaking, polyimide (PI) resin refers to the preparation of aromatic dianhydride and aromatic diamine or aromatic diisocyanate by solution polymerization to form a polyamic acid derivative, followed by ring closure and dehydration at high temperature to its secondary High heat-resistant resin obtained by amidation. In terms of preparing the polyimide resin, examples of aromatic dianhydrides include pyromellitic dianhydride (PMDA) and biphenyltetracarboxylic dianhydride (BPDA); examples of aromatic diamines include diamine biphenyl ether ( ODA), p-phenylenediamine (p-PDA), m-phenylenediamine (m-PDA), diaminodiphenylmethane (MDA) and diaminophenylhexafluoropropane (HFDA). [0003] Polyimide resins, which are not easily soluble, not easily melted, and can withstand relatively high temperatures, have many excellent characteristics su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18
CPCC08J5/18C08J2379/08C08L79/08C08G73/10Y10T428/31721B32B27/281
Inventor 朴晓准郑鹤基宋相旻姜忠锡
Owner KOLON IND INC