Method for manufacturing pure copper/copper chromium alloy composite contact material
A copper-chromium alloy and composite contact technology, applied in metal material coating process, electrical components, electrical switches, etc. problems, to achieve good anti-fusion welding performance, uniform distribution of Cr particles, and good affinity.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0025] A pure copper plate with a thickness of 2mm, with a length and width of 20mm×40mm, and a layer of copper-chromium alloy layer is laser clad on its surface. The process steps are:
[0026] The first step is to polish the part to be plated on the surface of the pure copper substrate with 400-600 emery cloth, and then clean the surface with acetone;
[0027] The second step, copper-chromium alloy coating preset: mix copper powder and chromium powder evenly in the ratio of 80:20 by weight, and the coating preset adopts the bonding method, that is, commercially available HZ-504 adhesive and Cu-Cr The powder is mixed at a volume ratio of 1:1.6, diluted with acetone to make a paste, and a Cu-Cr coating with a thickness of 1.2-1.4mm is preset on the surface of the pure copper substrate, placed in an oven, and the drying temperature is 80°C dry under conditions;
[0028] The third step is to carry out laser cladding on the coating. The laser process parameters are laser output ...
Embodiment 2
[0031] A pure copper sheet with a thickness of 3mm and a length and width of 15mm×45mm is laser clad on its surface with a layer of copper-chromium alloy. The process steps are:
[0032] The first step is to polish the part to be plated on the surface of the pure copper substrate with 400-600 emery cloth, and then clean the surface with acetone;
[0033] The second step, copper-chromium alloy coating preset: mix copper powder and chromium powder evenly in the ratio of 75:25 by weight, and the coating preset adopts the bonding method, that is, commercially available HZ-504 adhesive and Cu-Cr The powder is mixed at a volume ratio of 1:1.8, diluted with acetone to make a paste, and a Cu-Cr coating with a thickness of 1.3-1.5mm is preset on the surface of the pure copper substrate, placed in an oven, and the drying temperature is 90°C dry under conditions;
[0034] The third step is to carry out laser cladding on the coating. The laser process parameters are: laser output power 1...
Embodiment 3
[0037] A pure copper plate with a thickness of 4mm and a length and width of 25mm×50mm is laser clad on its surface with a layer of Cu-Cr alloy. The process steps are:
[0038] The first step is to polish the part to be plated on the surface of the pure copper substrate with 400-600 emery cloth, and then clean the surface with acetone;
[0039] The second step, copper-chromium alloy coating preset: mix copper powder and chromium powder evenly in the ratio of 70:30 by weight, and the coating preset adopts the bonding method, that is, the commercially available HZ-504 adhesive and Cu- Cr powder is mixed at a volume ratio of 1:2, diluted with acetone to make a paste, and a Cu-Cr coating with a thickness of 1.4-1.6 mm is preset on the surface of the pure copper substrate, placed in an oven, and dried at a temperature of 100 Dry at ℃;
[0040]The third step is to carry out laser cladding on the coating. The laser process parameters are laser output power 2.0kW, scanning speed 12m...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com