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Carrier tape feeder for chip mounter

A feeder and placement machine technology, applied in thin material processing, folding thin materials, semiconductor/solid-state device manufacturing, etc., can solve problems such as inability to feed electronic components and difficult separation

Active Publication Date: 2010-09-15
STS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the thickness of the electronic components held on the carrier tape is thick, or when the base tape is conveyed in an uneven and curved state along the length direction, the electronic components held on the carrier tape cannot be continuous even if the thickness of the electronic components is not thick. and automatically fed to the mounter
Also, since the vinyl cover is stuck to the base, it is difficult to separate the vinyl cover from the base at the leading end of the carrier tape even if the carrier tape is fed in a normal state

Method used

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  • Carrier tape feeder for chip mounter
  • Carrier tape feeder for chip mounter
  • Carrier tape feeder for chip mounter

Examples

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Embodiment Construction

[0031] The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown so that those skilled in the art may easily practice the invention.

[0032] It will be further understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another, and do not indicate relative importance or purpose. As used herein, the singular forms "a" and "the" are also intended to include plural forms unless the context clearly dictates otherwise.

[0033] The present invention relates to a tape feeder, which is a device for automatically feeding electronic components into a placement machine for mounting very small electronic components on printed circuit boards (hereinafter referred to as "tape feeder"). device"). Such as figure 1 As ex...

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Abstract

There is provided a carrier tape feeder for a chip mounter, which consecutively and automatically supplies a carrier tape which retains small electronic components at regular intervals and is sealed by a vinyl cover to the chip mounter to mount the components onto a printed circuit board. To consecutively and automatically supply components retained in a carrier tape to a chip mounter, the carrier tape feeder for the chip mounter comprises: a pickup section to separate a part of a vinyl cover from a base tape of the carrier tape so that the components retained in the base tape can be picked up, wherein the pickup section connected to an end of a tape feeder body comprises: a tape guide to secure a path of the carrier tape from which the part of the vinyl cover is separated longitudinally and to discharge the base tape and the vinyl cover together in the same direction simultaneously, wherein the tape guide comprises: a blade to separate longitudinally the vinyl cover from the base tape of the carrier tape being fed; and a vinyl cover guider to guide the separated vinyl cover.

Description

[0001] Cross References to Related Applications [0002] This application claims the rights and interests of Korean Patent Application No. 10-2009-0019757 filed on March 9, 2009 and Korean Patent Application No. 10-2010-0010848 filed on February 5, 2010, the disclosure of which patent applications It is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to a tape feeder for a mounter, and more particularly, to a tape feeder for a mounter which continuously and automatically holds, for example, semiconductor chips at regular intervals Carrier tapes of small electronic components such as small electronic components and sealing the components with a vinyl cover are fed to a placement machine for mounting the components on a printed circuit board. Background technique [0004] A mounter is a device that picks up small components fed by a feeder by vacuum suction using a head nozzle, and mounts the components on a printed ci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/02H05K13/04H01L21/58
CPCB65H2701/1942B65H37/002H05K13/0417B65H45/08H05K13/0419
Inventor 金光植
Owner STS
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