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A heat sink and cooling fin technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of poor space adaptability and versatility of the radiator, and inability to adapt to the installation space, etc., to achieve good space adaptability and versatility Effect
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AI technical title is built by PatSnap AI team. It summarizes the technical point description of the patent document.
A heat sink and cooling fin technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of poor space adaptability and versatility of the radiator, and inability to adapt to the installation space, etc., to achieve good space adaptability and versatility Effect
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[0013] The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.
[0014] Please refer to figure 1 , is the radiator 10 of the first embodiment of the present invention, the radiator 10 is made of a material with good thermal conductivity and flexibility, such as aluminum, aluminum alloy, etc. Plates, that is, a first heat conducting plate 11, a second heat conducting plate 12, and a plurality of cooling fins 13 connected between the two heat conducting plates 11, 12.
[0015] The two heat conducting plates 11 , 12 have the same shape and are rectangular plates, and the two heat conducting plates 11 , 12 are parallel and facing each other.
[0016] These cooling fins 13 have the same shape, and each cooling fin 13 is curved from the first heat conducting plate 11 to the second heat conducting plate 12. These cooling fins 13 are all bent in the same direction, and two adjacent heat dissipation fins T...
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Abstract
The invention discloses an electronic device comprising a housing and a heating electronic element arranged in the housing, wherein the heating electronic element is provided with a radiator. The radiator comprises two heat-conducting plates and a plurality of radiation fins, wherein the heat-conducting plates are arranged at interval, and the radiating fins are connected between two heat-conducting plates; each radiating fin is bent in an arc shape from one heat conducting plate to the other heat conducting plate; an arc-shaped airflow path is formed between the adjacent two radiating fins, and each radiating fin has the capability of generating elastic deformation along the bending direction so as to change space between the two heat conducting plates; two heat-absorbing plates of the radiator are respectively connected on the heating electronic element and the housing; the radiator can cause the radiating fins to be further bent or stretched to adapt to variation of space between two heat-absorbing plates, and thus, the radiator has better spatial adaptability and generality.
Description
technical field [0001] The invention relates to a radiator for dissipating heat from a heating electronic component and an electronic device using the radiator. Background technique [0002] With the rapid development of the electronic information industry, the high-speed, high-frequency and integration of heat-generating electronic components such as central processing units will cause a sharp increase in heat generation. If the heat is not removed in time, the temperature of the heat-generating electronic components will rise, which will lead Damage to heat-generating electronic components or degradation of their performance. Therefore, the industry usually installs a heat sink on the heat-generating electronic component. [0003] The heat sink includes a heat conduction plate and a plurality of heat dissipation fins extending vertically upward from the heat conduction plate. However, the heat dissipation fins commonly used in the industry are all rigid structures, and ea...
Claims
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