Ion source loading and unloading device

Abstract

The invention discloses an ion source loading and unloading device, which is used for loading and unloading ion sources in an arc reaction chamber, and comprises a semi-cylindrical bracket, a ferrule and a handle, wherein the semi-cylindrical bracket matches with the ion sources in shape to bear the ion sources; the ferrule is arranged on an end of the semi-cylindrical bracket and matched with a steel bushing of the arc reaction chamber in shape so as to be clamped on the steel bushing; the ferrule is provided with an opening which matches with the ion sources in shape and is used for the ionsources to get in and out; and the handle is arranged on the top of the ferrule. The ion sources loading and unloading device are used for realizing accurate position as loading and unloading the ionsources, so as to accurately insert the ion sources into the steel bushing. During frequent maintenance for an ion implanter, the device in the invention can ensure quality of the ion sources, improve assembling efficiency, guarantee success rate of the maintenance and avoid duplication of labor.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to an ion source loading and unloading device. Background technique [0002] In the semiconductor manufacturing process, ion implantation is an important step in semiconductor manufacturing. It is to implant ions of special materials into wafers (wafer) through energy acceleration. The ions implanted into the wafer are concentrated in specific layers of the wafer. [0003] Ion implantation is to inject an ion beam with a certain charge and energy into the wafer after being accelerated by an electric field and selected by a magnetic field, so as to change or adjust the electrical properties of certain parts in the wafer. [0004] In order to ensure the quality of ion implantation, it is necessary to regularly maintain the ion implantation machine. When performing regular maintenance on the ion implantation machine, reassembling the ion source (SOURCE) is a link that must ...

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Problems solved by technology

[0008] The present invention aims to solve the problem that in the prior art, when the ion source needs to be loaded and unloaded for regular maintenance of the ion implantation machine, the loading and unloading is difficult, the ion source is easily damaged, and the ion source cannot be accurately positioned when the ion source is installed, and the installation cannot be sealed, resulting in the ion generation box. Technical problems such as vacuum leaks

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